EP2C8F256C8N

IC FPGA 182 I/O 256FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 182 165888 8256 256-LBGA

Quantity 361 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs516Number of Logic Elements/Cells8256
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of EP2C8F256C8N – Cyclone® II FPGA, 8,256 Logic Elements, 256-LBGA

The EP2C8F256C8N is a Cyclone® II family Field Programmable Gate Array (FPGA) offered by Intel. Built around a cost-efficient Cyclone II architecture, it provides 8,256 logic elements, approximately 0.166 Mbits of embedded memory, and a flexible I/O complement for mid-density programmable logic designs.

Ideal for commercial embedded processing and low-cost DSP applications, this surface-mount FPGA delivers a balanced combination of integration, I/O capacity, and on-chip resources for control, interface bridging, and signal processing tasks within a 256-ball BGA package.

Key Features

  • Logic Capacity — 8,256 logic elements for implementing combinational and sequential logic, state machines, and glue logic in mid-complexity designs.
  • Embedded Memory — Approximately 0.166 Mbits (165,888 bits) of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
  • I/O Resources — 182 I/O pins to support broad interfacing needs across multiple banks and standards for sensors, peripherals, and external memory connectivity.
  • Cyclone II Architecture — Family-level architecture includes global clock network, dedicated PLLs, embedded multipliers and flexible routing to support synchronous designs and DSP-oriented functions.
  • Power & Voltage — Core supply voltage range of 1.15 V to 1.25 V to match system power rails and enable predictable power planning.
  • Package & Mounting — Supplied in a 256-ball LBGA/FBGA footprint (256-LBGA; supplier package listed as 256-FBGA 17×17), surface-mount assembly compatible with standard PCB processes.
  • Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C for typical commercial applications.
  • Compliance — RoHS-compliant manufacturing to meet common environmental and assembly requirements.

Typical Applications

  • Embedded Processing — Low-cost embedded control and state-machine implementations that require on-chip memory and programmable logic integration.
  • DSP & Signal Processing — Mid-range DSP tasks using embedded multipliers and block RAM to accelerate filtering, data path arithmetic, and small-scale signal processing.
  • Interface Bridging — Protocol conversion and bus bridging between dissimilar interfaces using plentiful I/O and programmable logic.
  • Custom I/O Aggregation — Aggregating and conditioning sensor or peripheral signals where flexible I/O and on-chip memory reduce external component count.

Unique Advantages

  • Balanced Integration: 8,256 logic elements combined with embedded memory provide a compact platform for mid-complexity functions without relying on multiple discrete components.
  • Flexible I/O Count: 182 I/O pins support a wide mix of external interfaces, reducing the need for additional I/O expanders or glue logic.
  • Architecture Features: Cyclone II family features such as global clocking and PLLs help implement synchronized, high-function designs with predictable timing behavior.
  • Surface-Mount BGA Package: 256-ball LBGA/FBGA packaging enables dense PCB layouts while supporting standard surface-mount assembly workflows.
  • RoHS Compliant: Environmentally compliant manufacturing simplifies procurement for assemblies targeting common regulatory requirements.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with a wide array of commercial electronic products and systems.

Why Choose EP2C8F256C8N?

The EP2C8F256C8N combines a Cyclone II architecture with 8,256 logic elements, embedded memory, and extensive I/O to deliver a practical, integrated solution for mid-density programmable logic applications. Its family-level features—such as clock management and embedded DSP resources—allow engineers to implement efficient embedded processing and interface solutions while keeping board-level BOM and complexity under control.

This part is well suited to developers and procurement teams building commercial products that need a reliable, RoHS-compliant FPGA platform in a compact 256-ball BGA package, with predictable power and temperature specifications for mainstream applications.

To request a quote or submit a purchase inquiry for EP2C8F256C8N, please provide your quantity and delivery requirements and we will respond with pricing and availability information.

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