EP4CE15F23I7N

The EP4CE15F23I7N is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC designed for implementing custom digital logic on a compact surface-mount package. It combines 15,408 logic elements, approximately 0.5 Mbits of embedded memory, and 343 I/O to support complex board-level designs that require flexible programmable logic.

Built for industrial-grade deployments, this device operates from a 1.15–1.25 V core supply and is specified for an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-demanding environments where programmable integration and reliability are required.

Key Features

• Core Logic 15,408 logic elements (cells) for implementing custom digital logic, state machines, and glue logic.
• Embedded Memory Approximately 0.5 Mbits of on-chip RAM for buffers, FIFOs, and small data stores.
• I/O Density 343 user I/O pins to support multiple parallel interfaces and mixed-signal board connectivity.
• Package and Mounting 484-FBGA (23×23) package in a 484-BGA footprint, designed for surface-mount assembly and high-density PCB layouts.
• Power Low-voltage core operation specified at 1.15–1.25 V to match common FPGA power architectures.
• Environmental & Reliability Industrial-grade device with operating temperature range of −40 °C to 100 °C and RoHS compliance.
• Documentation Supported by Cyclone IV device handbook and related datasheet documentation for design and integration guidance.

Typical Applications

• Industrial Control Use in industrial automation and control systems where industrial temperature rating and reliable programmable logic are required.
• Board-Level Integration High I/O count supports complex interface aggregation, protocol bridging, and system glue logic on compact PCBs.
• Prototyping and Custom Logic Implement and iterate custom state machines, signal conditioning logic, and feature prototypes with reprogrammable hardware.

Unique Advantages

• High Logic Capacity: 15,408 logic elements provide substantial resources for medium-complexity designs without resorting to larger device families.
• Significant On-Chip Memory: Approximately 0.5 Mbits of embedded RAM reduces dependence on external memory for buffering and small data structures.
• Generous I/O Count: 343 I/O pins enable flexible interfacing to sensors, peripherals, and high-pin-count connectors.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet harsher operating environments and extended-temperature deployments.
• Compact BGA Packaging: 484-FBGA (23×23) surface-mount package balances PCB space efficiency with routing density for modern board designs.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose EP4CE15F23I7N?

The EP4CE15F23I7N positions itself as a versatile Cyclone IV E FPGA option for designs that need a balance of logic density, embedded memory, and high I/O in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it appropriate for applications where environmental robustness is a requirement.

This part is well suited to engineers developing medium-complexity programmable logic solutions, board-level interface consolidation, or industrial automation features that demand reprogrammable hardware and dependable operating-range specifications.

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