EP4CE15F23I7

The EP4CE15F23I7 is a Cyclone® IV E field-programmable gate array (FPGA) device from Intel, offered in a 484-ball BGA package. It provides on-chip programmable logic and I/O resources suitable for embedded logic implementations and industrial applications.

Built on the Cyclone IV device family architecture, this device combines 15,408 logic elements, approximately 0.52 Mbits of embedded RAM, and 343 user I/O pins in a surface-mount 484-FBGA (23×23) package, operating over a wide industrial temperature range.

Key Features

• Core Logic  15,408 logic elements provide substantial programmable fabric for glue logic, protocol bridging, and custom datapath implementations.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for FIFOs, buffers, and small data storage.
• I/O Capacity  343 user I/O pins support dense interfacing to peripherals, sensors, and other system components.
• Package  484-ball FBGA (23×23) surface-mount package (484-BGA) for compact board-level integration and high pin-count routing.
• Power  Core supply voltage range of 1.15 V to 1.25 V to match system power rails and ensure predictable core operation.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Compliance  RoHS compliant for regulatory and environmental compatibility in applicable markets.
• Mounting  Surface-mount device suited for automated PCB assembly and standard reflow processes.

Typical Applications

• Industrial Control  The industrial temperature rating (−40 °C to 100 °C) and extensive I/O count make this FPGA suitable for control logic, motor-drive interfaces, and factory automation controllers.
• Embedded Processing and Glue Logic  With 15,408 logic elements and embedded RAM, the device can implement protocol conversion, peripheral aggregation, and custom datapaths in embedded systems.
• Sensor and I/O Aggregation  High I/O density supports aggregation and conditioning of signals from multiple sensors or field I/O modules in monitoring and data-acquisition systems.

Unique Advantages

• Substantial Logic Capacity:  15,408 logic elements provide room for moderate-complexity designs without external ASICs or CPLDs.
• On-Chip Memory:  Approximately 0.52 Mbits of embedded RAM reduces dependency on external memory for buffering and small data storage.
• High I/O Density:  343 I/O pins enable direct interfacing to a wide range of peripherals, reducing board-level multiplexing and external I/O expanders.
• Industrial-Grade Operation:  −40 °C to 100 °C operating range supports deployment in harsh and temperature-variable environments.
• Compact BGA Packaging:  The 484-FBGA (23×23) package balances high pin count and compact footprint for space-constrained PCB designs.
• Regulatory Compatibility:  RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose EP4CE15F23I7?

The EP4CE15F23I7 positions itself as a versatile Cyclone IV E FPGA option for embedded and industrial applications that require a balanced combination of programmable logic, on-chip memory, and abundant I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for long-life deployments in demanding environments.

Designers seeking a mid-range FPGA with clear, verifiable specifications—logic capacity, embedded RAM, I/O count, package details, and supply-voltage range—will find the EP4CE15F23I7 suitable for tasks such as interface bridging, control logic, sensor aggregation, and on-board data buffering while leveraging the Cyclone IV device family documentation for detailed electrical and timing guidance.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CE15F23I7. Our team can provide lead-time, volume pricing, and support for integration into your design cycle.