EP4CE15F23C8LN

The EP4CE15F23C8LN is a Cyclone IV E field-programmable gate array (FPGA) offered in a 484-ball BGA package. The device provides 15,408 logic elements and approximately 0.516 Mbits of on-chip RAM in a compact surface-mount package, enabling configurable digital logic for a wide range of commercial embedded designs.

With a high I/O count, low-voltage core supply range, and commercial operating temperature range, this FPGA is suited to applications that require flexible logic implementation, moderate embedded memory, and dense I/O in a space-efficient footprint.

Key Features

• Logic Capacity  15,408 logic elements provide the programmable resources needed for custom control, glue-logic, and moderate-complexity FPGA designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM supports buffering, small FIFOs, and distributed memory functions without external SRAM.
• I/O Resources  Up to 343 user I/Os enable extensive peripheral and bus interfacing directly from the FPGA fabric.
• Power and Core Voltage  Core supply operates in the 0.97 V to 1.03 V range, supporting low-voltage system designs and ensuring defined operating conditions.
• Package and Mounting  484-ball FBGA (23 × 23) package, surface-mount mounting type, delivering a compact, board-level footprint for high-density designs.
• Operating Temperature  Commercial-grade rating with specified operation from 0 °C to 85 °C for typical commercial environments.
• Regulatory Compliance  RoHS compliant, supporting lead-free manufacturing processes and environmental compliance requirements.

Typical Applications

• Custom Logic and Control  Implement user-defined state machines, protocol bridges, and control functions using the device’s 15,408 logic elements.
• Memory-Buffered Functions  Leverage approximately 0.516 Mbits of embedded RAM for small buffering, FIFO, or scratchpad memory needs without external memory.
• I/O-Intensive Interfaces  Use up to 343 I/Os to connect multiple peripherals, sensors, or parallel interfaces directly to the FPGA fabric.

Unique Advantages

• Substantial Logic Density  15,408 logic elements offer a balance of capacity and footprint for moderate-complexity programmable designs.
• On-Chip Memory  Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for control-level buffering and local data storage.
• High I/O Count  343 I/Os provide flexible connectivity for multi-peripheral or multi-bus applications, simplifying board-level integration.
• Compact BGA Package  484-FBGA (23×23) enables a high-pin-count solution in a compact area, useful where board space is constrained.
• Commercial Temperature Rating  Specified operation from 0 °C to 85 °C makes the device suitable for standard commercial environments.
• RoHS Compliant  Supports lead-free assembly processes and environmental compliance in product manufacturing.

Why Choose EP4CE15F23C8LN?

The EP4CE15F23C8LN combines a practical mix of logic capacity, embedded memory, and a high I/O count in a compact 484-FBGA package, making it well suited to commercial embedded designs that require configurable digital logic and dense connectivity. The device’s defined core voltage range and commercial temperature specification provide predictable operating conditions for production designs.

This FPGA is a good fit for design teams needing a configurable logic device with moderate on-chip memory and substantial I/O in a surface-mount BGA form factor, backed by comprehensive device documentation and datasheet-level specifications.

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