EP4CE15F23C7N

The EP4CE15F23C7N is a Cyclone IV E field programmable gate array (FPGA) in a 484-ball FBGA package designed for commercial embedded applications. It provides a balanced combination of logic density, on-chip memory, and a high I/O count for control, signal processing, and interface integration in space-constrained designs.

Built with a core supply range of 1.15 V to 1.25 V and rated for 0 °C to 85 °C operation, this device targets commercial systems that require medium-scale programmable logic and flexible I/O integration while maintaining RoHS compliance.

Key Features

• Logic Capacity  15,408 logic elements (LEs) to implement medium-complexity custom logic, glue logic, and control functions.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for FIFOs, buffers, and small data stores.
• I/O Density  343 I/O pins to support multiple parallel interfaces, sensors, and peripheral connections.
• Power and Core Supply  Core voltage range of 1.15 V to 1.25 V to match system power rails and enable predictable core operation.
• Package and Mounting  484-FBGA (23×23) surface-mount package providing a compact footprint for board-level integration.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C suitable for standard indoor and consumer-facing electronics.
• Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Use the FPGA for custom control logic, protocol bridging, and peripheral aggregation in general-purpose embedded platforms.
• Communications and Networking Equipment  Implement packet buffering, interface adaptation, and medium-complexity data handling using the available logic and embedded RAM.
• Consumer Electronics  Integrate the device for display controllers, user-interface logic, and peripheral management where a compact BGA package and high I/O count are beneficial.
• Prototyping and Development  Rapidly iterate hardware logic and validate algorithms in hardware prior to final ASIC or larger FPGA deployments.

Unique Advantages

• High Logic Density: 15,408 logic elements enable implementation of medium-scale designs without external FPGA expansion.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for small buffers and state machines.
• Extensive I/O: 343 I/O pins allow flexible interfacing to multiple peripherals and parallel buses within a single device.
• Compact Packaging: 484-FBGA (23×23) provides a space-efficient solution for board-level designs where footprint is constrained.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation for a wide range of indoor and consumer applications.
• RoHS Compliant: Built to meet common environmental manufacturing requirements.

Why Choose EP4CE15F23C7N?

The EP4CE15F23C7N positions itself as a practical, mid-range Cyclone IV E FPGA option for commercial designs that need a balance of logic capacity, embedded memory, and a high number of I/Os in a compact package. Its electrical and thermal specifications make it suitable for indoor and consumer-facing applications where reliable programmable logic is required.

Designers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with moderate logic resources and flexible integration options will find this device appropriate for control logic, interface consolidation, and prototype-to-production workflows.

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