EP4CE15F23C8L

IC FPGA 343 I/O 484FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA

Quantity 899 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O343Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of EP4CE15F23C8L – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA

The EP4CE15F23C8L is a Cyclone IV E family FPGA manufactured by Intel, packaged in a 484-ball FBGA (23 × 23) surface-mount package. It provides a programmable logic fabric with 15,408 logic elements, approximately 0.516 Mbits of embedded memory, and 343 general-purpose I/O pins for flexible system interfacing.

Designed for commercial-grade applications, this device targets designs that require moderate logic density, sizable on-chip RAM, and a high I/O count while operating within a 0.97–1.03 V core supply range and a 0 °C to 85 °C ambient temperature window.

Key Features

  • Logic Capacity  15,408 logic elements for implementing custom digital functions and glue logic within mid-density designs.
  • Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, FIFOs, and small on-chip data storage needs.
  • I/O Count  343 I/O pins to support multiple interfaces and high pin-count connectivity for peripheral integration.
  • Core Supply Range  Core voltage specified from 0.97 V to 1.03 V to match system power domains operating in the low-voltage range.
  • Package & Mounting  484-FBGA (23 × 23) ball-grid array in a surface-mount package for compact board-level integration.
  • Operating Conditions  Commercial grade operation from 0 °C to 85 °C for general-purpose embedded and consumer applications.
  • Compliance  RoHS-compliant manufacturing status.
  • Documentation  Device details and operating guidance are documented in the Cyclone IV Device Handbook (Volume 3).

Typical Applications

  • Consumer and Embedded Systems  Programmable control, display drivers, and peripheral glue logic in commercial electronic products.
  • Communications and Networking  Protocol bridging, packet buffering, and interface adaptation where moderate logic density and many I/Os are required.
  • Prototyping and Development  Platform for proof-of-concept designs and development work that benefit from reprogrammable logic and embedded RAM.
  • Industrial Automation (Commercial Grade)  Control and monitoring functions in commercial automation equipment that operate within the specified temperature range.

Unique Advantages

  • Balanced Logic and Memory  15,408 logic elements combined with approximately 0.516 Mbits of embedded RAM provide a practical balance for mid-density designs without external memory for small buffers.
  • High I/O Availability  343 I/Os enable multiple parallel interfaces and connectivity options, reducing the need for external multiplexing components.
  • Compact BGA Package  The 484-FBGA (23 × 23) surface-mount package allows dense board-level integration while conserving PCB area.
  • Low-Voltage Core Operation  A narrow core voltage range (0.97–1.03 V) facilitates integration into low-voltage power domains and simplifies power-supply planning.
  • Commercial Temperature Range  Specified operation from 0 °C to 85 °C suits a wide range of commercial products and environments.
  • Vendor Documentation  Supported by Intel’s Cyclone IV Device Handbook, providing detailed device specifications and design guidance.

Why Choose EP4CE15F23C8L?

The EP4CE15F23C8L positions itself as a commercially graded, mid-density Cyclone IV E FPGA optimized for designs that need a combination of logic resources, embedded RAM, and a high I/O count in a compact BGA footprint. Its documented operating conditions and supply requirements make it suitable for commercial embedded applications, communications interfaces, and development platforms.

Engineers and procurement teams seeking a vendor-documented FPGA backed by Intel’s device handbook will find this part suitable for projects that require reliable programmable logic, straightforward power-domain integration, and significant on-chip I/O capacity.

Request a quote or submit an inquiry to obtain pricing and availability for the EP4CE15F23C8L and to discuss suitability for your specific design requirements.

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