EP4CE15F23C8
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA |
|---|---|
| Quantity | 608 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 343 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP4CE15F23C8 – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA
The EP4CE15F23C8 is a Cyclone IV E family Field Programmable Gate Array (FPGA) in a 484-ball BGA package. It provides a balanced combination of programmable logic, embedded memory, and high I/O density for commercial-grade applications.
Key on-device resources include 15,408 logic elements, approximately 0.49 Mbits of embedded RAM (516,096 bits), and 343 general-purpose I/O pins. The device operates from a core supply of 1.15 V to 1.25 V and supports commercial temperature operation from 0 °C to 85 °C.
Key Features
- Programmable Logic 15,408 logic elements for implementing custom digital functions, state machines, and glue logic.
- Embedded Memory 516,096 bits (approximately 0.49 Mbits) of on-chip RAM to support FIFOs, buffers, and local data storage without external SRAM.
- I/O Density 343 I/O pins to support complex interfacing and parallel connectivity directly from the FPGA package.
- Package and Mounting 484-ball BGA (484-FBGA, 23×23) in a surface-mount format for compact board integration and high pin count routing.
- Power Supply Core voltage range of 1.15 V to 1.25 V to match system power architectures and power sequencing requirements.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation suitable for standard commercial electronics environments.
- Regulatory Compliance RoHS compliant for lead-free assembly and environmental regulatory alignment.
Unique Advantages
- High integration density: 15,408 logic elements and on-chip RAM reduce the need for discrete glue logic and external memory, simplifying board-level design.
- Extensive I/O capability: 343 I/O pins enable diverse peripheral connections and parallel interfaces without adding external I/O expanders.
- Compact, manufacturable package: 484-BGA (23×23) surface-mount package provides a high pin count in a space-efficient footprint for dense PCB layouts.
- Commercial readiness: Specified operating temperature range (0 °C to 85 °C) and RoHS compliance make the device appropriate for mainstream commercial products and assemblies.
- Clear power specification: Defined core supply range (1.15 V to 1.25 V) supports straightforward power delivery design and verification.
Why Choose EP4CE15F23C8?
The EP4CE15F23C8 positions itself as a commercially graded Cyclone IV E FPGA that delivers a practical balance of logic density, embedded memory, and high I/O count in a compact 484-BGA package. Its documented supply voltage range and temperature rating make it suitable for standard commercial electronic systems where on-chip resources and routing density are important.
This device is appropriate for designs that require significant programmable logic and embedded RAM on a single IC while maintaining a high number of external connections. The RoHS compliance and surface-mount BGA package support modern manufacturing and assembly processes.
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