EP4CE15F23C8

IC FPGA 343 I/O 484FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA

Quantity 608 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O343Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of EP4CE15F23C8 – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA

The EP4CE15F23C8 is a Cyclone IV E family Field Programmable Gate Array (FPGA) in a 484-ball BGA package. It provides a balanced combination of programmable logic, embedded memory, and high I/O density for commercial-grade applications.

Key on-device resources include 15,408 logic elements, approximately 0.49 Mbits of embedded RAM (516,096 bits), and 343 general-purpose I/O pins. The device operates from a core supply of 1.15 V to 1.25 V and supports commercial temperature operation from 0 °C to 85 °C.

Key Features

  • Programmable Logic  15,408 logic elements for implementing custom digital functions, state machines, and glue logic.
  • Embedded Memory  516,096 bits (approximately 0.49 Mbits) of on-chip RAM to support FIFOs, buffers, and local data storage without external SRAM.
  • I/O Density  343 I/O pins to support complex interfacing and parallel connectivity directly from the FPGA package.
  • Package and Mounting  484-ball BGA (484-FBGA, 23×23) in a surface-mount format for compact board integration and high pin count routing.
  • Power Supply  Core voltage range of 1.15 V to 1.25 V to match system power architectures and power sequencing requirements.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation suitable for standard commercial electronics environments.
  • Regulatory Compliance  RoHS compliant for lead-free assembly and environmental regulatory alignment.

Unique Advantages

  • High integration density: 15,408 logic elements and on-chip RAM reduce the need for discrete glue logic and external memory, simplifying board-level design.
  • Extensive I/O capability: 343 I/O pins enable diverse peripheral connections and parallel interfaces without adding external I/O expanders.
  • Compact, manufacturable package: 484-BGA (23×23) surface-mount package provides a high pin count in a space-efficient footprint for dense PCB layouts.
  • Commercial readiness: Specified operating temperature range (0 °C to 85 °C) and RoHS compliance make the device appropriate for mainstream commercial products and assemblies.
  • Clear power specification: Defined core supply range (1.15 V to 1.25 V) supports straightforward power delivery design and verification.

Why Choose EP4CE15F23C8?

The EP4CE15F23C8 positions itself as a commercially graded Cyclone IV E FPGA that delivers a practical balance of logic density, embedded memory, and high I/O count in a compact 484-BGA package. Its documented supply voltage range and temperature rating make it suitable for standard commercial electronic systems where on-chip resources and routing density are important.

This device is appropriate for designs that require significant programmable logic and embedded RAM on a single IC while maintaining a high number of external connections. The RoHS compliance and surface-mount BGA package support modern manufacturing and assembly processes.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for EP4CE15F23C8.

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