EP4CE15F23C6

The EP4CE15F23C6 is a Cyclone® IV E field-programmable gate array offering 15,408 logic elements, 343 general-purpose I/O pins, and approximately 0.52 Mbits of embedded memory. The device is supplied in a 484-FBGA (23×23) surface-mount package and operates from a 1.15 V to 1.25 V core supply.

Designed for commercial-temperature applications (0 °C to 85 °C) and RoHS compliant, the device provides a balance of logic density, I/O capacity, and on-chip RAM for hardware-accelerated logic, protocol bridging, and complex I/O implementations.

Key Features

• Core Logic  15,408 logic elements provide a defined capacity for implementing custom digital logic and moderate-complexity designs.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM enables local buffering and small lookup tables for state storage and data handling.
• I/O Resources  343 I/O pins support extensive external interfacing, useful for multi-channel or multi-protocol designs.
• Package and Mounting  484-FBGA (23×23) package, surface-mount, provides a compact footprint while supporting high pin count routing.
• Power  Core supply specified between 1.15 V and 1.25 V to match system power-rail design requirements.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C for standard ambient-temperature deployments.
• Compliance and Documentation  RoHS compliant; detailed device specifications and design guidance are available in the Cyclone IV device handbook and device datasheet.

Typical Applications

• I/O-Intensive Systems  Leverage the device's 343 I/O pins to connect sensors, external peripherals, and parallel interfaces while consolidating glue logic on-chip.
• Logic-Moderate Acceleration  Deploy the 15,408 logic elements to implement custom datapaths, finite-state machines, and application-specific accelerators.
• Protocol Bridging and Interface Conversion  Use on-chip logic and embedded RAM for buffering and timing control when translating between multiple protocols.
• Prototyping and Development  A compact 484-FBGA package with substantial I/O makes the part suitable for board-level prototyping where moderate density and I/O count are required.

Unique Advantages

• Balanced Logic and I/O Capacity: 15,408 logic elements combined with 343 I/Os enable implementations that require both moderate logic resources and broad external connectivity.
• On-Chip Memory for Local Storage: Approximately 0.52 Mbits of embedded RAM reduces the need for external memory on small buffering and LUT tasks, simplifying board design.
• Compact High-Pin-Count Packaging: The 484-FBGA (23×23) package delivers high I/O density in a surface-mount form factor suited to space-constrained designs.
• Defined Power Envelope: A specified core voltage range of 1.15 V to 1.25 V allows predictable power-supply design and integration with system rails.
• Commercial-Grade Availability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications and regulatory compliance.
• Comprehensive Documentation: Supported by the Cyclone IV device handbook and datasheet content covering operating conditions, DC characteristics, I/O standards, and switching specifications.

Why Choose EP4CE15F23C6?

The EP4CE15F23C6 positions itself as a commercially graded Cyclone IV E FPGA option where a defined balance of logic density, substantial I/O, and embedded RAM are required. Its 15,408 logic elements, 343 I/Os, and compact 484-FBGA footprint make it suitable for designs that consolidate interface logic, implement custom accelerators, or require multiple external connections without exceeding moderate board-space budgets.

Backed by Cyclone IV device documentation, the EP4CE15F23C6 offers predictable electrical characteristics and detailed design guidance—helpful for engineers building reproducible, scalable solutions within the specified operating and power envelopes.

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