EP4CE15F17I8L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 165 516096 15408 256-LBGA |
|---|---|
| Quantity | 648 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 165 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP4CE15F17I8L – Cyclone® IV E FPGA — 15,408 logic elements, 165 I/Os, 256-LBGA
The EP4CE15F17I8L is an Intel Cyclone® IV E field programmable gate array (FPGA) provided in a 256-LBGA package. It integrates 15,408 logic elements and approximately 0.516 Mbits of embedded RAM to support mid-density programmable logic and on-chip memory requirements.
Specified for industrial-grade use, the device offers a wide operating temperature span and a low-voltage core supply. These attributes make it suitable for designs that require reliable, programmable logic in constrained board-space packages.
Key Features
- Logic Capacity — 15,408 logic elements and 963 CLBs provide the programmable fabric for implementing moderate-complexity logic, state machines, and glue logic.
- Embedded Memory — Approximately 0.516 Mbits of on-chip RAM for FIFOs, buffers, and small on-chip data storage needs.
- I/O Density — 165 I/O pins to support a variety of external interfaces and parallel connectivity requirements.
- Core Voltage — Low-voltage supply range from 0.970 V to 1.03 V for the device core.
- Thermal and Reliability — Industrial-grade operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Package & Mounting — 256-LBGA / 256-FBGA (17×17) package in a surface-mount form factor to minimize PCB footprint.
- Compliance — RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Industrial control and automation — Industrial-grade temperature rating and broad I/O count enable interface and control logic in automation and factory equipment.
- Embedded systems and prototyping — Moderate logic density and on-chip RAM support custom peripherals, glue logic, and embedded prototyping tasks.
- Communications and networking equipment — The combination of logic resources and plentiful I/Os supports protocol bridging, packet processing control, and interface adaptation.
Unique Advantages
- Balanced logic and memory — 15,408 logic elements paired with approximately 0.516 Mbits of embedded RAM delivers a practical balance for mid-range programmable designs.
- Industrial temperature capability — Rated from −40 °C to 100 °C to address designs deployed in wide-temperature environments.
- Compact, board-friendly package — 256-LBGA (256-FBGA 17×17) surface-mount package reduces PCB area while providing substantial I/O count.
- Low-voltage core operation — Core supply specified between 0.970 V and 1.03 V to align with low-voltage system power rails.
- Regulatory alignment — RoHS compliance supports environmental requirements for many commercial and industrial programs.
Why Choose EP4CE15F17I8L?
The EP4CE15F17I8L positions itself as a versatile mid-density Cyclone IV E FPGA optimized for industrial applications where reliable operation across a wide temperature range and a compact footprint are important. With 15,408 logic elements, 963 CLBs, and 165 I/Os, it accommodates a broad set of embedded functions while keeping board space and BOM count under control.
This device is appropriate for engineers and procurement teams seeking a field-programmable solution that combines on-chip RAM, a substantial I/O complement, and industrial-grade thermal tolerance. Detailed electrical and performance characteristics are documented in the Cyclone IV device documentation for engineering qualification and design integration.
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