EP4CE15F17C9L

The EP4CE15F17C9L is an Intel Cyclone® IV E field-programmable gate array supplied in a 256-LBGA package. It integrates a substantial logic fabric and embedded memory with a broad set of I/O to address mid-density programmable logic requirements.

This commercial-grade FPGA (0 °C to 85 °C) is specified for surface-mount assembly and operates from a core supply range of 0.97 V to 1.03 V. It is RoHS compliant and supported by the Cyclone IV device handbook and datasheet documentation for device-level electrical and switching specifications.

Key Features

• Logic Capacity  — 15,408 logic elements provide the programmable fabric required for medium-complexity logic, control, and glue-logic designs.
• Embedded Memory  — Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) for FIFOs, buffering, and small on-chip data stores.
• I/O Density  — 165 user I/O pins to support interfaces with sensors, peripherals, and external devices.
• Package & Mounting  — 256-LBGA package; supplier device package listed as 256-FBGA (17 × 17) for compact board-level integration and surface-mount assembly.
• Supply Voltage  — Core supply specified at 0.970 V to 1.030 V, enabling operation within the Cyclone IV E core voltage window.
• Operating Range & Grade  — Commercial grade with operating temperature from 0 °C to 85 °C; suitable for a wide range of standard electronic products.
• Compliance  — RoHS compliant, meeting common environmental restrictions for lead-free assemblies.
• Documentation  — Supported by Cyclone IV device handbook material covering operating conditions, DC characteristics, switching specifications, and power details.

Typical Applications

• Embedded Control  — Implement custom control logic and timing-critical state machines using the device’s 15,408 logic elements and available I/O resources.
• Sensor and Data Acquisition  — Use the 165 I/O pins to interface with multiple sensors, ADCs, and peripherals while buffering data in on-chip RAM.
• Protocol Bridging and Glue Logic  — Create protocol translators, bus bridges, and system glue using the FPGA’s programmable fabric and I/O count.
• Prototyping and Development  — Rapidly prototype digital designs that require reprogrammable logic capacity and moderate embedded memory.

Unique Advantages

• Mid-range Logic Integration: 15,408 logic elements offer substantial on-chip logic for consolidating discrete logic and small system functions into a single FPGA.
• On-chip Memory Availability: Approximately 0.516 Mbits of embedded RAM enables internal buffering and temporary data storage without external memory.
• Ample I/O Count: 165 I/O pins support multi-sensor, multi-peripheral, and mixed-signal interfacing needs on compact PCBs.
• Compact Surface-mount Package: 256-LBGA / 256-FBGA (17 × 17) packaging balances board space with pin availability for dense layouts.
• Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance streamline use in consumer and commercial products.
• Vendor Documentation: Device-level handbook and datasheet content provide detailed operating conditions, DC characteristics, and switching performance for engineering validation.

Why Choose EP4CE15F17C9L?

The EP4CE15F17C9L positions itself as a commercially graded Cyclone IV E FPGA that combines medium-density logic, a modest embedded memory footprint, and a sizable I/O count in a compact 256-ball BGA package. These attributes make it suitable for designers seeking to consolidate logic, implement custom interfaces, or prototype moderate-complexity digital systems.

With documented device-level electrical, switching, and power specifications available in the Cyclone IV handbook and datasheet, the EP4CE15F17C9L supports engineering workflows that require verifiable component behavior and predictable integration into board-level designs.

Request a quote or submit an inquiry to receive pricing and availability for EP4CE15F17C9L and to discuss how this Cyclone IV E FPGA can fit your next design.