EP4CE15F17C8

The EP4CE15F17C8 is a Cyclone IV E family FPGA IC providing 15,408 logic elements and approximately 0.52 Mbits of embedded memory. Built for surface-mount deployment in a compact 256-ball BGA package, it offers flexible I/O and programmable logic resources for custom digital designs.

With a 1.15 V to 1.25 V core supply range and a commercial operating temperature range of 0 °C to 85 °C, this device is suited to projects that require mid-density programmable logic, on-chip RAM and a high pin-count I/O interface within a compact package.

Key Features

• Logic Capacity  15,408 logic elements provide the programmable fabric for implementing custom digital logic, state machines and glue logic.
• On‑Chip Memory  Approximately 0.52 Mbits of embedded RAM for buffering, FIFOs and small lookup tables within the FPGA fabric.
• I/O Density  165 general-purpose I/O pins to support multiple external interfaces and parallel data paths.
• Power  Core voltage supply range of 1.15 V to 1.25 V for the FPGA core.
• Package & Mounting  256-ball BGA package (listed as 256-LBGA and supplier package 256-FBGA 17×17) in a surface-mount format suited to high-density PCB designs.
• Thermal & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.
• Documentation  Device-specific operating conditions, absolute maximum ratings, DC characteristics and switching specifications are provided in the Cyclone IV device handbook and device datasheet.

Typical Applications

• Custom Digital Logic  Implement state machines, packet processing or protocol glue logic using the device’s 15,408 logic elements and embedded RAM.
• Interface Bridging  Use the 165 I/O pins to bridge multiple parallel or serial interfaces on a single FPGA for board-level protocol conversion and signal aggregation.
• On‑Chip Buffering  Leverage approximately 0.52 Mbits of embedded RAM for data buffering, small FIFOs or temporary storage to smooth data flow between system blocks.

Unique Advantages

• Right‑sized Logic and Memory: 15,408 logic elements combined with approximately 0.52 Mbits of embedded memory deliver a balanced platform for mid-density designs without excessive overhead.
• High I/O Count: 165 I/O pins enable complex board-level interfacing and flexible signal routing for multi-peripheral systems.
• Compact BGA Package: The 256-ball BGA (17×17) surface-mount package minimizes PCB area while supporting high pin density for space-constrained designs.
• Controlled Power Envelope: Core supply of 1.15 V–1.25 V gives a narrow, defined power requirement for system power design and sequencing.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for a wide range of standard commercial applications.
• RoHS Compliant: Aligns with environmental and manufacturing requirements for lead-free production.

Why Choose EP4CE15F17C8?

The EP4CE15F17C8 combines mid-range logic capacity, on-chip RAM and a high I/O count in a compact 256-ball BGA footprint—making it well suited for engineering teams that need reprogrammable logic, interface flexibility and embedded memory in a surface-mount package. Its defined core voltage range and commercial temperature rating simplify power and thermal planning for production designs.

This device is appropriate for engineers building mid-density programmable solutions that require a balance of logic resources, I/O density and compact packaging, with the assurance of detailed device specifications available in the Cyclone IV device documentation.

Request a quote or submit an inquiry today to get pricing and availability for EP4CE15F17C8 and to discuss lead times and ordering options.