EP4CE15F17C7

The EP4CE15F17C7 is a Cyclone IV E field-programmable gate array from Intel, offered in a 256-LBGA (256-FBGA 17×17) surface-mount package for commercial applications. It integrates a moderate-density FPGA fabric providing programmable logic, on-chip embedded memory, and a wide complement of user I/O.

With 15,408 logic elements, approximately 0.52 Mbits of embedded memory, and 165 user I/O pins, this device targets commercial embedded designs that require flexible logic integration, protocol bridging, and I/O-dense implementations while operating from a 1.15 V to 1.25 V core supply.

Key Features

• FPGA Core — Cyclone IV E architecture implemented in a compact 256-LBGA package with 15,408 logic elements suitable for moderate-density designs.
• On-chip Memory — Approximately 0.52 Mbits (516,096 bits) of embedded RAM for implementing buffers, FIFOs, and small data structures without external memory.
• User I/O — 165 user I/O pins to support multiple parallel interfaces, custom bus implementations, and mixed-signal I/O routing.
• Power Supply — Core voltage supply range of 1.15 V to 1.25 V to match common FPGA power domains and regulator choices.
• Package & Mounting — 256-FBGA (17×17) package in a surface-mount form factor for high-density PCB integration.
• Operating Range & Compliance — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS-compliant manufacturing.
• Documentation — Supported by the Cyclone IV device handbook and related datasheet documentation for detailed electrical and timing specifications.

Typical Applications

• Embedded Control and Glue Logic — Use the device to consolidate discrete logic, implement custom state machines, and bridge interfaces within commercial embedded systems.
• Protocol Bridging and I/O Expansion — 165 user I/O pins enable protocol conversion, bus interfacing, and aggregation of multiple peripheral connections.
• Prototyping and Development — Moderate logic and embedded memory make this FPGA suitable for proof-of-concept designs and iterative hardware development.

Unique Advantages

• Programmable Integration: Reduces PCB component count by integrating logic functions and glue logic into a single programmable device.
• I/O Density: 165 user I/O pins provide flexibility for multi-interface designs and parallel signal routing without additional expander ICs.
• On-chip Memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and small data structures, minimizing external memory bandwidth needs.
• Compact Surface-Mount Package: The 256-FBGA (17×17) package enables high-density board layouts while maintaining a small footprint.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• RoHS Compliant: Manufactured in accordance with RoHS requirements for lead-free assembly and environmental compliance.

Why Choose EP4CE15F17C7?

The EP4CE15F17C7 balances moderate logic capacity, on-chip memory, and substantial I/O density in a compact surface-mount package, making it well suited for commercial embedded systems, prototyping projects, and designs that require flexible, reconfigurable logic. Its Cyclone IV E architecture and supporting documentation provide engineers with the specifications needed to integrate this device into production and development workflows.

Ideal for teams seeking a programmable solution to consolidate discrete logic, implement protocol bridging, or add custom I/O handling, the EP4CE15F17C7 offers a scalable building block with clear electrical and thermal parameters for predictable system integration.

Request a quote or contact sales to discuss availability, pricing, and how the EP4CE15F17C7 can fit into your next design.