EP4CE15F17C6

The EP4CE15F17C6 is a Cyclone IV family field programmable gate array (FPGA) offered by Intel. It provides a configurable hardware fabric with 15,408 logic elements and approximately 0.516 Mbits of embedded memory for implementing custom digital logic and system functions.

Designed as a commercial‑grade, surface‑mount device in a 256‑ball BGA package, the part targets applications that require moderate logic density, 165 I/O pins, and standard commercial temperature operation (0 °C to 85 °C). Documentation includes the Cyclone IV device handbook covering operating conditions, DC characteristics, power, and switching specifications.

Key Features

• Logic Capacity  15,408 logic elements for implementing custom logic, state machines, and glue‑logic functions.
• Embedded Memory  Approximately 0.516 Mbits (516,096 bits) of on‑chip RAM to support FIFOs, buffers, and small data storage.
• I/O and Package  165 user I/O pins in a surface‑mount 256‑ball package (256‑LBGA / supplier package: 256‑FBGA 17×17) to support multi‑signal interfaces.
• Supply Voltage  Core supply range of 1.15 V to 1.25 V as specified for the device.
• Operating Range  Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Mounting and Compliance  Surface‑mount BGA package; RoHS‑compliant material status.
• Documentation and Characterization  Supported by Cyclone IV device handbook material covering operating conditions, absolute maximum ratings, DC characteristics, power consumption, and switching characteristics.

Typical Applications

• Custom Logic and Glue‑Logic  Implement board‑level control, protocol translation, and interface timing where up to 15,408 logic elements are required.
• Prototyping and Development  Use as a reprogrammable platform for validating RTL, system integration, and early hardware bring‑up.
• I/O Aggregation and Interface Management  Leverage 165 I/O pins to consolidate multiple peripheral signals and manage board‑level interconnects.

Unique Advantages

• Balanced Logic and Memory  15,408 logic elements combined with approximately 0.516 Mbits of embedded RAM enables a mix of combinational/sequential logic and local data buffering.
• Ample I/O Count  165 I/O pins provide flexibility for multi‑bus and multi‑peripheral designs without external expanders.
• Compact BGA Packaging  256‑ball BGA footprint (256‑LBGA / 256‑FBGA 17×17) offers a space‑efficient mounting option for dense PCBs.
• Commercial Temperature Rating  Specified operation from 0 °C to 85 °C for typical commercial environments.
• Controlled Core Supply  Core voltage specified between 1.15 V and 1.25 V to align with system power‑rail planning.
• Regulatory Compliance  RoHS‑compliant construction to meet common environmental requirements.

Why Choose EP4CE15F17C6?

The EP4CE15F17C6 positions itself as a commercially graded Cyclone IV FPGA option for designers who need moderate logic density, on‑chip memory, and a sizable I/O complement in a compact BGA package. Its documented operating conditions, DC and switching characteristics make it suitable for system integration tasks, prototyping, and interface aggregation where reconfigurable hardware is required.

Backed by Intel’s Cyclone IV device documentation, the part is appropriate for engineering teams seeking a known FPGA family with clear electrical and thermal specifications for commercial applications.

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