EP4CE15E22I8LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 81 516096 15408 144-LQFP Exposed Pad |
|---|---|
| Quantity | 568 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 81 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP4CE15E22I8LN – Cyclone IV E FPGA IC, 144-LQFP Exposed Pad
The EP4CE15E22I8LN is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel presented in a 144-LQFP exposed pad package. It provides mid-range programmable logic capacity with integrated on-chip RAM and a broad I/O count, targeted at industrial-grade embedded designs.
Designed for surface-mount assembly and rated for industrial operating conditions, this device suits applications that require programmable logic integration with a defined core supply range and extended temperature tolerance.
Key Features
- Core Logic — 15,408 logic elements delivering programmable fabric for custom logic, control, and glue‑logic functions.
- Embedded Memory — Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, lookup tables, and state storage.
- I/O Capability — 81 user I/O pins to interface with peripherals, sensors, and other system components.
- Power and Core Supply — Core voltage supply range specified at 0.970 V to 1.030 V for controlled core operation.
- Package & Mounting — 144-LQFP exposed pad, supplier device package listed as 144-EQFP (20×20), optimized for surface-mount PCB assembly.
- Industrial Temperature Grade — Operating temperature from −40 °C to 100 °C suitable for industrial environments.
- Standards Compliance — RoHS compliant.
- Documentation — Supported by the Cyclone IV Device Handbook (Volume 3), which provides detailed operating conditions, DC characteristics, and switching specifications.
Typical Applications
- Industrial Embedded Systems — Use programmable logic to implement control, preprocessing, or protocol handling in industrial equipment within an industrial temperature range.
- Embedded Logic Integration — Provide mid-range programmable logic and on-chip RAM for system customization, glue logic, and deterministic hardware functions.
- Prototype and Development Boards — Surface-mount 144-LQFP package and accessible I/O count make the device suitable for evaluation and embedded development platforms.
Unique Advantages
- Mid‑range Logic Capacity: 15,408 logic elements give designers room for moderately complex hardware implementations without excess overhead.
- On‑chip Memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and small data structures without external memory.
- Industrial Reliability: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsher environments.
- Practical I/O Count: 81 I/O pins provide flexible connectivity for sensors, actuators, and peripheral interfaces.
- Standard Surface‑Mount Packaging: 144‑LQFP exposed pad (144‑EQFP, 20×20) enables conventional PCB assembly and thermal management via exposed pad.
- Documented Specifications: Device behavior and limits are defined in the Cyclone IV Device Handbook (Volume 3), covering operating conditions, DC and switching characteristics.
Why Choose EP4CE15E22I8LN?
The EP4CE15E22I8LN positions itself as a practical, industrial‑grade Cyclone IV E FPGA option when designers need a balance of logic capacity, on‑chip memory, and I/O in a compact surface‑mount package. Its defined core supply window and documented device handbook support predictable integration into embedded systems.
This part is well suited for development teams and production designs that require mid‑level programmable logic resources, RoHS compliance, and an extended operating temperature range backed by Cyclone IV series documentation.
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