EP4CE15F17A7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 165 516096 15408 256-LBGA |
|---|---|
| Quantity | 1,426 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 165 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 516096 |
Overview of EP4CE15F17A7N – Cyclone® IV E FPGA, 15,408 logic elements, 256-LBGA
The EP4CE15F17A7N is a Cyclone® IV E field programmable gate array (FPGA) from Intel, delivering 15,408 logic elements and on-chip RAM for programmable logic implementations. It combines a mid-range logic capacity with 165 I/O pins and a compact 256-ball BGA package for board-level integration.
Qualified to AEC‑Q100 and specified for operation from –40°C to 125°C, this device is targeted at designs that require automotive-grade qualification, deterministic supply requirements (1.15 V to 1.25 V), and RoHS compliance.
Key Features
- Core Logic Approximately 15,408 logic elements provide programmable logic capacity suitable for a wide range of control and glue-logic functions.
- Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 total bits) for buffering, FIFOs, and small data‑store needs within the FPGA fabric.
- I/O Capacity 165 available I/O pins support extensive interface flexibility for sensors, peripherals, and board-level connectivity.
- Package & Mounting Surface-mount 256-LBGA package (supplier device package listed as 256-FBGA, 17×17) enables compact PCB integration.
- Power Specified core supply range of 1.15 V to 1.25 V allows precise power budgeting and compatibility with regulated FPGA power rails.
- Temperature Range Rated for operation from –40°C to 125°C, supporting temperature-demanding environments.
- Qualification & Compliance Automotive grade with AEC‑Q100 qualification and RoHS compliance for regulatory and industry acceptance.
Typical Applications
- Automotive electronic subsystems Use as programmable logic in automotive control modules where AEC‑Q100 qualification and extended temperature operation are required.
- Sensor and interface bridging Leverage 165 I/Os and embedded RAM to implement protocol bridging, signal aggregation, and pre-processing close to sensors.
- On-board data buffering Embedded memory (~0.52 Mbits) supports short-term buffering, FIFOs, and small lookup tables within vehicle electronics or other temperature-critical systems.
Unique Advantages
- Automotive‑qualified device: AEC‑Q100 qualification and automotive grade designation support deployment in vehicle electronics and related applications that demand qualification.
- Balanced logic and memory: The combination of ~15,408 logic elements and ~0.52 Mbits of on-chip RAM provides a balanced resource mix for control, interfacing, and moderate data‑processing tasks.
- Generous I/O count: 165 I/Os enable multiple peripheral connections and flexible board-level signal routing without immediate need for external multiplexing.
- Compact BGA footprint: The 256-ball BGA (17×17 supplier package) supports dense PCB layouts while maintaining a reliable surface-mount form factor.
- Wide operating temperature: Rated from –40°C to 125°C, the device is suitable for thermally demanding environments typical of automotive applications.
- Regulatory compliance: RoHS compliance helps simplify end-product environmental compliance and manufacturing sourcing.
Why Choose EP4CE15F17A7N?
The EP4CE15F17A7N positions itself as a practical, automotive-qualified FPGA option for designs that require a mid-level logic fabric, embedded memory, and a substantial I/O complement in a compact 256-LBGA package. Its specified core voltage range and extended temperature rating make it appropriate for electronic modules where predictable electrical and thermal behavior is important.
Engineers developing automotive electronics or other temperature-sensitive, qualification-driven systems will find this device useful for integrating programmable logic, implementing protocol bridges, and providing on-board buffering while relying on Intel's Cyclone IV E device family heritage and published device documentation.
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