EP4CE15F17C9LN

The EP4CE15F17C9LN is a Cyclone IV E field programmable gate array (FPGA) IC from Intel, supplied in a 256-LBGA package. It provides a commercial-grade programmable logic platform with 15,408 logic elements, embedded RAM, and a 165-pin I/O complement for flexible digital designs.

This device targets commercial embedded applications that require configurable logic, moderate on-chip memory, and a compact surface-mount BGA package. Key electrical and environmental parameters include a core supply window of 0.970 V to 1.03 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 15,408 logic elements to implement custom digital functions and control logic within a single FPGA device.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, FIFOs, and small data structures without external memory.
• I/O Resources — 165 general-purpose I/O pins for interfacing with peripherals, sensors, and other digital subsystems.
• Power and Core Supply — Core voltage operation specified between 0.970 V and 1.03 V for compatibility with established low-voltage power domains.
• Package and Mounting — Surface-mount 256-LBGA package (supplier device package 256-FBGA, 17 × 17) for compact board integration and high-density routing.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation, suitable for commercial embedded environments.
• RoHS Compliant — Environmentally compliant with RoHS requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol bridging, and peripheral aggregation in compact, surface-mount designs.
• Data Path and Glue Logic — Replace discrete logic with programmable logic to consolidate glue logic, state machines, and timing adjustments.
• Prototyping and Development — Use the Cyclone IV E device for validating digital algorithms and hardware architectures before production deployment.

Unique Advantages

• Flexible Logic Capacity: 15,408 logic elements provide sufficient density for a wide range of moderate-complexity digital designs without external PLD components.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• High I/O Count: 165 I/O pins enable direct interfacing to multiple peripherals and subsystem signals, simplifying board-level design.
• Compact BGA Footprint: 256-LBGA / 256-FBGA (17 × 17) package supports high-density layouts and minimizes PCB area.
• Defined Commercial Operating Range: Rated 0 °C to 85 °C and specified core voltage range (0.970 V to 1.03 V) for predictable integration into commercial power and thermal designs.
• Regulatory Compliance: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose EP4CE15F17C9LN?

The EP4CE15F17C9LN positions itself as a practical, commercial-grade Cyclone IV E FPGA option when you need moderate logic density, embedded RAM, and a high I/O count in a compact surface-mount BGA package. Its specified core voltage range and commercial temperature rating make it suitable for a broad set of embedded applications where predictability and integration are priorities.

This device is well suited for designers consolidating discrete logic, implementing custom peripheral interfaces, or prototyping digital systems that require on-chip memory and flexible I/O. Delivered by Intel and supported by Cyclone IV device documentation, the EP4CE15F17C9LN offers a verifiable specification set for procurement and system design.

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