EP4CGX15BF14C7N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 552960 14400 169-LBGA |
|---|---|
| Quantity | 800 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LBGA | Number of I/O | 72 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 900 | Number of Logic Elements/Cells | 14400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 552960 |
Overview of EP4CGX15BF14C7N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 552960 14400 169-LBGA
The EP4CGX15BF14C7N is an Intel Cyclone® IV GX field programmable gate array (FPGA) offered in a compact 169-ball LBGA package. It delivers 14,400 logic elements, approximately 0.553 Mbits of embedded memory, and 72 I/O, making it suitable for commercial-grade embedded logic applications that require moderate logic density and on-chip memory.
This device operates from a 1.16 V to 1.24 V supply, is specified for surface-mount assembly, and is rated for commercial temperature operation from 0 °C to 85 °C. It is RoHS-compliant and available in a 169-FBGA (14×14) supplier package footprint.
Key Features
- Field-programmable logic 14,400 logic elements provide the programmable fabric required for custom digital logic and control functions.
- On-chip memory Approximately 0.553 Mbits of embedded memory for data buffering, state storage, and intermediate processing.
- I/O capacity 72 user I/O pins to connect multiple peripherals, buses, or interfaces directly to the FPGA fabric.
- Package 169-LBGA package case with supplier device package 169-FBGA (14×14) for compact, board-level integration.
- Power Low-voltage operation with a supply range of 1.16 V to 1.24 V to match precise power-rail designs.
- Temperature and grade Commercial grade device specified for 0 °C to 85 °C operation.
- Mounting and compliance Surface-mount package and RoHS-compliant construction for lead-free assembly processes.
Unique Advantages
- Balanced logic density: 14,400 logic elements provide a mid-range capacity for customizable digital designs without excessive board area.
- Integrated on-chip memory: Approximately 0.553 Mbits of embedded RAM reduces external memory needs for buffering and state storage.
- Ample I/O: 72 I/O pins enable flexible connectivity to sensors, peripherals, and bus interfaces on a single device.
- Compact packaging: 169-LBGA / 169-FBGA (14×14) footprint supports high-density PCB layouts and surface-mount assembly.
- Low-voltage operation: Narrow supply range (1.16 V to 1.24 V) supports designs with precise core voltage requirements.
- Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.
Why Choose EP4CGX15BF14C7N?
The EP4CGX15BF14C7N positions itself as a commercial-grade, mid-density Cyclone® IV GX FPGA that combines 14,400 logic elements, approximately 0.553 Mbits of embedded memory, and 72 I/O in a compact 169-ball package. Its low-voltage core and surface-mount 169-FBGA (14×14) footprint make it suitable for embedded systems where board space, power rails, and on-chip resources are key design constraints.
This device is well-suited for designers and procurement teams seeking a programmable logic solution that delivers balanced logic capacity and integrated memory while adhering to commercial temperature and RoHS requirements.
Request a quote or submit a purchase inquiry to receive pricing and availability for EP4CGX15BF14C7N.

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