EP4CGX15BF14C7N

IC FPGA 72 I/O 169FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 552960 14400 169-LBGA

Quantity 800 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package169-FBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case169-LBGANumber of I/O72Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs900Number of Logic Elements/Cells14400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits552960

Overview of EP4CGX15BF14C7N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 552960 14400 169-LBGA

The EP4CGX15BF14C7N is an Intel Cyclone® IV GX field programmable gate array (FPGA) offered in a compact 169-ball LBGA package. It delivers 14,400 logic elements, approximately 0.553 Mbits of embedded memory, and 72 I/O, making it suitable for commercial-grade embedded logic applications that require moderate logic density and on-chip memory.

This device operates from a 1.16 V to 1.24 V supply, is specified for surface-mount assembly, and is rated for commercial temperature operation from 0 °C to 85 °C. It is RoHS-compliant and available in a 169-FBGA (14×14) supplier package footprint.

Key Features

  • Field-programmable logic 14,400 logic elements provide the programmable fabric required for custom digital logic and control functions.
  • On-chip memory Approximately 0.553 Mbits of embedded memory for data buffering, state storage, and intermediate processing.
  • I/O capacity 72 user I/O pins to connect multiple peripherals, buses, or interfaces directly to the FPGA fabric.
  • Package 169-LBGA package case with supplier device package 169-FBGA (14×14) for compact, board-level integration.
  • Power Low-voltage operation with a supply range of 1.16 V to 1.24 V to match precise power-rail designs.
  • Temperature and grade Commercial grade device specified for 0 °C to 85 °C operation.
  • Mounting and compliance Surface-mount package and RoHS-compliant construction for lead-free assembly processes.

Unique Advantages

  • Balanced logic density: 14,400 logic elements provide a mid-range capacity for customizable digital designs without excessive board area.
  • Integrated on-chip memory: Approximately 0.553 Mbits of embedded RAM reduces external memory needs for buffering and state storage.
  • Ample I/O: 72 I/O pins enable flexible connectivity to sensors, peripherals, and bus interfaces on a single device.
  • Compact packaging: 169-LBGA / 169-FBGA (14×14) footprint supports high-density PCB layouts and surface-mount assembly.
  • Low-voltage operation: Narrow supply range (1.16 V to 1.24 V) supports designs with precise core voltage requirements.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.

Why Choose EP4CGX15BF14C7N?

The EP4CGX15BF14C7N positions itself as a commercial-grade, mid-density Cyclone® IV GX FPGA that combines 14,400 logic elements, approximately 0.553 Mbits of embedded memory, and 72 I/O in a compact 169-ball package. Its low-voltage core and surface-mount 169-FBGA (14×14) footprint make it suitable for embedded systems where board space, power rails, and on-chip resources are key design constraints.

This device is well-suited for designers and procurement teams seeking a programmable logic solution that delivers balanced logic capacity and integrated memory while adhering to commercial temperature and RoHS requirements.

Request a quote or submit a purchase inquiry to receive pricing and availability for EP4CGX15BF14C7N.

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