EP4CGX15BF14I7
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 552960 14400 169-LBGA |
|---|---|
| Quantity | 705 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LBGA | Number of I/O | 72 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 900 | Number of Logic Elements/Cells | 14400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 552960 |
Overview of EP4CGX15BF14I7 – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 I/Os, ~0.553 Mbits, 14,400 LEs, 169-LBGA
The EP4CGX15BF14I7 is an Intel Cyclone IV GX FPGA configured in a 169-LBGA package for surface-mount applications. It integrates 14,400 logic elements, approximately 0.553 Mbits of embedded memory, and 72 I/Os to support a wide range of programmable logic tasks.
Designed for industrial environments, this device operates from a core supply of 1.16 V to 1.24 V and across an operating temperature range of −40 °C to 100 °C, providing deterministic on-chip resources for embedded and industrial designs.
Key Features
- Core Logic 14,400 logic elements and 900 LABs provide flexible combinational and sequential logic resources for custom digital functions.
- Embedded Memory Approximately 0.553 Mbits of on-chip RAM supports buffering, FIFOs, and small local data stores without external memory.
- I/O Count 72 I/Os allow integration of multiple interfaces and peripherals directly to the FPGA fabric.
- Power Narrow core voltage range of 1.16 V to 1.24 V suitable for controlled low-voltage system designs.
- Package & Mounting 169-LBGA package (supplier device package: 169-FBGA, 14×14) in a surface-mount form factor for compact board integration.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C to meet demanding thermal environments.
- Regulatory Compliance RoHS compliant for adherence to common environmental directives.
Typical Applications
- Industrial Control Implement custom control logic, I/O aggregation, and deterministic sequencing in industrial automation systems using the device’s logic and I/O resources.
- Communications Interfaces Create protocol adapters, custom interface bridging, and packet-processing blocks leveraging on-chip logic and embedded RAM.
- Embedded System Prototyping Rapidly prototype digital subsystems and custom accelerators where moderate logic density and embedded memory are required.
Unique Advantages
- Balanced Logic and Memory: 14,400 logic elements combined with ~0.553 Mbits of embedded RAM provide a practical balance for control and data-buffering tasks.
- Industrial Temperature Range: Specified for −40 °C to 100 °C operation to support deployments in thermally challenging environments.
- Compact Surface-Mount Package: 169-LBGA (169-FBGA, 14×14) package enables high-density board layouts while keeping a small PCB footprint.
- Low-Voltage Core: 1.16 V to 1.24 V core supply range supports designs targeting low-voltage logic domains.
- RoHS Compliant: Meets RoHS requirements to simplify environmental compliance in product designs.
Why Choose EP4CGX15BF14I7?
The EP4CGX15BF14I7 positions itself as a compact, industrial-grade FPGA option that combines modest logic capacity with on-chip memory and a practical I/O count. Its surface-mount 169-LBGA packaging and controlled core-voltage range make it suitable for embedded and industrial designs where board space, thermal range, and integration matter.
Engineers selecting this device benefit from a predictable set of resources—14,400 logic elements, ~0.553 Mbits of RAM, 72 I/Os, and 900 LABs—delivered in an industry-oriented temperature rating and RoHS-compliant package, supporting reliable, long-term deployments.
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