EP4CGX15BN11I7N

The EP4CGX15BN11I7N is a Cyclone® IV GX field programmable gate array (FPGA) from Intel, offering a mid-density programmable-logic fabric suitable for industrial applications. It provides 14,400 logic elements, approximately 0.55 Mbits of embedded memory, and 72 user I/O in a compact 148-WFQFN package.

Designed for systems that require configurable logic and robust operation, this device delivers a balance of integration, I/O capability, and an extended industrial temperature range for deployment in harsh environments.

Key Features

• Core Logic 14,400 logic elements provide the programmable resources for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.55 Mbits of on-chip RAM (552,960 total RAM bits) for buffering, FIFOs, and small on-chip storage needs.
• I/O Capability 72 user I/O pins allow direct interfacing to external peripherals, sensors, and control circuits.
• Power Supply Operates from a core voltage supply in the range of 1.16 V to 1.24 V, enabling defined integration with board power domains.
• Package 148-WFQFN dual-rows with exposed pad (148-QFN, 11 × 11 mm supplier package) provides a compact footprint with thermal pad for heat dissipation.
• Operating Temperature Industrial-grade temperature range from −40 °C to 100 °C for reliable operation in elevated-temperature environments.
• Regulatory Compliance RoHS-compliant construction for environmentally conscious designs.

Typical Applications

• Industrial Control and Automation — Implement motor control logic, sensor interfacing, and custom control algorithms using the device’s programmable resources and industrial temperature rating.
• Embedded Systems — Use as a mid-density programmable fabric for glue logic, protocol bridging, and custom peripheral implementation in embedded designs.
• I/O-Intensive Designs — Utilize 72 user I/O to connect multiple sensors, actuators, or external devices without immediately requiring additional I/O expanders.

Unique Advantages

• Balanced Integration: 14,400 logic elements and on-chip memory provide a mix of logic capacity and embedded RAM for compact, single-chip implementations.
• Compact, Thermally Managed Package: 148-WFQFN with exposed pad and an 11 × 11 mm QFN supplier package enable space-efficient board layouts with improved thermal contact.
• Industrial Temperature Performance: Rated for −40 °C to 100 °C operation, making it suitable for deployments in demanding thermal environments.
• Defined Power Envelope: Narrow core voltage window (1.16 V to 1.24 V) helps simplify power-supply selection and design verification.
• RoHS Compliant: Environmentally compliant manufacturing supports regulatory requirements for many commercial and industrial applications.

Why Choose EP4CGX15BN11I7N?

The EP4CGX15BN11I7N delivers a practical combination of mid-range logic capacity, embedded memory, and I/O count in a compact QFN package, making it a solid choice for engineers who need configurable logic in space-constrained, temperature-demanding applications. Its industrial-grade temperature rating and RoHS compliance align with long-term deployment needs.

Manufactured by Intel as part of the Cyclone® IV GX family, this device is well suited to designers building embedded controllers, industrial automation systems, and I/O-rich custom logic subsystems that require a reliable, mid-density FPGA solution.

Request a quote or submit an inquiry to learn about availability and pricing for EP4CGX15BN11I7N.