EP4CGX15BN11C8N

IC FPGA 72 I/O 148QFN
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 552960 14400 148-WFQFN Dual Rows, Exposed Pad

Quantity 995 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package148-QFN (11x11)GradeCommercialOperating Temperature0°C – 85°C
Package / Case148-WFQFN Dual Rows, Exposed PadNumber of I/O72Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs900Number of Logic Elements/Cells14400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits552960

Overview of EP4CGX15BN11C8N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC

The EP4CGX15BN11C8N is a Cyclone® IV GX FPGA optimized for mid-density programmable logic integration. It delivers 14,400 logic elements, approximately 0.55 Mbits of embedded memory, and 72 user I/Os in a compact 148‑WFQFN dual‑row surface‑mount package with an exposed pad.

Designed for commercial-grade applications, this device operates from a 1.16 V to 1.24 V core supply and is rated for 0 °C to 85 °C operation, offering a balance of integration, I/O capacity, and form-factor suited to space-constrained boards.

Key Features

  • Core Logic  14,400 logic elements to implement combinational and sequential logic functions at mid density.
  • Embedded Memory  Approximately 0.55 Mbits of on-chip RAM for buffering, FIFOs, and small data stores.
  • I/O Count  72 user I/Os for interfacing with peripherals, sensors, and external logic.
  • Power  Core voltage supply range of 1.16 V to 1.24 V to match systems designed around this core rail.
  • Package & Mounting  148‑WFQFN dual‑row, exposed pad package (148‑QFN, 11×11 mm) in a surface‑mount form factor for compact board layouts.
  • Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS‑compliant manufacturing and materials.

Unique Advantages

  • Mid-density integration: 14,400 logic elements and on-chip RAM enable consolidation of moderate logic and memory functions into a single device, reducing component count.
  • Compact package: 148‑WFQFN (11×11 mm) with exposed pad provides a small PCB footprint for space-limited designs.
  • Flexible I/O resources: 72 user I/Os support a variety of external interfaces without immediate need for additional I/O expanders.
  • Commercial suitability: Specified 0 °C to 85 °C operation for general-purpose commercial applications.
  • Controlled core supply: Defined 1.16–1.24 V core voltage range simplifies power-supply planning for systems using this FPGA.
  • RoHS compliant: Compliance supports lead‑free assembly and regulatory requirements for many consumer and industrial products.

Why Choose EP4CGX15BN11C8N?

The EP4CGX15BN11C8N positions itself as a practical mid-density FPGA option that combines a substantial logic count and embedded RAM with a compact 148‑WFQFN surface‑mount package. Its 72 I/Os and defined core-voltage range make it suitable for designers seeking to integrate multiple functions while keeping board area and part count down.

For commercial product lines where moderate logic density, on‑chip memory, and a small-package solution are required, this device offers a balanced mix of integration and predictable operating characteristics, backed by RoHS compliance for modern manufacturing processes.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for EP4CGX15BN11C8N.

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