EP4SGX290KF40I3

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17661952 291200 1517-BBGA, FCBGA

Quantity 456 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF40I3 – Stratix® IV GX FPGA, 291,200 logic elements

The EP4SGX290KF40I3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1517-BBGA FCBGA package. It provides a high-density programmable fabric with 291,200 logic elements, a large embedded memory footprint, and a substantial I/O count for complex, I/O‑heavy designs.

Targeted at industrial applications, this device combines significant on-chip resources with a wide operating temperature range and surface-mount packaging to support robust system designs that require high integration and reliable operation.

Key Features

  • Core capacity — 291,200 logic elements available for implementing complex digital logic and custom architectures.
  • Embedded memory — Approximately 17.66 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
  • I/O — 744 user I/O pins to interface with high-pin-count peripherals and multi-channel systems.
  • Power — Supported supply voltage range from 870 mV to 930 mV to meet specified core power requirements.
  • Package and mounting — 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA (40×40)) designed for surface-mount assembly.
  • Industrial grade and temperature — Industrial-grade device rated for operation from -40°C to 100°C for deployment in demanding environments.
  • Regulatory — RoHS compliant.

Unique Advantages

  • High-density logic resources: 291,200 logic elements enable implementation of large, integrated digital subsystems on a single device, reducing board-level complexity.
  • Significant on-chip memory: Approximately 17.66 Mbits of embedded RAM supports large buffers, packet queues, and algorithmic state without relying on external memory.
  • Extensive I/O count: 744 I/Os simplify connectivity to multiple peripherals and parallel interfaces, lowering the need for external multiplexing logic.
  • Industrial temperature rating: Operation from -40°C to 100°C supports deployment in industrial environments with wide temperature swings.
  • Compact, surface-mount package: The 1517-BBGA (1517-FBGA 40×40) package delivers a high pin count in a compact footprint suitable for dense PCB designs.
  • Controlled core supply range: Defined voltage supply (870 mV–930 mV) enables predictable power budgeting and thermal design.

Why Choose EP4SGX290KF40I3?

The EP4SGX290KF40I3 positions itself as a high-capacity Stratix® IV GX FPGA for industrial designs that demand a combination of large logic capacity, on-chip memory, and extensive I/O. Its industrial temperature rating and surface-mount BGA packaging make it appropriate for integrated systems where reliability and density matter.

Manufactured by Intel, this device is suited for teams building complex digital systems that require on-chip resources to minimize external components while maintaining a predictable power and thermal profile across a wide operating temperature range.

Request a quote or submit an inquiry to obtain pricing and availability information for EP4SGX290KF40I3. Our team can provide technical details and support to evaluate fit for your design needs.

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