EP4SGX290KF40C3NAB

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17661952 291200 1517-BBGA, FCBGA

Quantity 717 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs116480Number of Logic Elements/Cells291200
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF40C3NAB – Stratix IV GX FPGA, 291,200 logic elements, 1517-FBGA

The EP4SGX290KF40C3NAB is a Stratix IV GX field-programmable gate array (FPGA) in a 1517-FBGA surface-mount package. It provides a high logic capacity device fabric paired with substantial on-chip memory and a large I/O count for demanding digital designs.

Designed for applications that require high aggregate bandwidth and significant signal processing resources, this commercial-grade device combines 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 744 I/O pins. The Stratix IV device handbook notes architectural features such as high-speed transceiver support, DSP blocks, and extensive clock and signal-integrity resources for complex system designs.

Key Features

  • Core Logic  291,200 logic elements to implement large-scale custom logic functions and complex finite-state machines.
  • Embedded Memory  Approximately 17.66 Mbits of on-chip RAM for buffering, packet storage, and data-intensive processing.
  • I/O Density  744 general-purpose I/O pins to support wide parallel interfaces, external memory buses, and numerous peripheral connections.
  • High-Speed Transceiver and DSP Support  Stratix IV GX architecture includes high-speed transceiver features and digital signal processing blocks (as documented in the device handbook) for bandwidth-intensive and signal-processing tasks.
  • Package and Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA, surface-mount package for high-density board integration.
  • Power  Nominal core voltage supply range of 870 mV to 930 mV for core power planning and regulator design.
  • Commercial Temperature Grade  Rated operating temperature 0 °C to 85 °C for standard commercial applications.
  • Compliance  RoHS-compliant lead-free construction for regulatory and environmental compliance.

Typical Applications

  • High‑Performance Communications  Leverage the Stratix IV GX transceiver and large I/O count to implement protocol bridging, packet processing, and bandwidth-heavy networking functions.
  • Signal Processing and DSP  Use the device’s dense logic fabric and embedded memory to build filters, FFTs, and other real-time signal-processing pipelines.
  • Video and Imaging Systems  High logic density and on-chip RAM support frame buffering, video pre‑processing, and parallel image pipelines.
  • Custom Accelerator and Compute  The combination of logic elements, DSP resources, and memory enables hardware acceleration for compute‑intensive algorithms and dataflow architectures.

Unique Advantages

  • High logic capacity: 291,200 logic elements enable large-scale designs without external programmable logic.
  • Substantial embedded memory: Approximately 17.66 Mbits of on-chip RAM reduces dependency on external memory for intermediate storage and buffering.
  • Extensive I/O: 744 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and high-pin-count connectors.
  • Package density: 1517-FBGA (40×40) FCBGA packaging delivers a compact board footprint with high pin density for space-constrained systems.
  • Documented architecture features: The Stratix IV family handbook details high-speed transceiver capabilities, DSP blocks, clocking resources, and signal-integrity features to support complex system requirements.
  • Commercial readiness: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance simplify integration into standard electronic products.

Why Choose EP4SGX290KF40C3NAB?

The EP4SGX290KF40C3NAB positions itself as a high-capacity Stratix IV GX FPGA suited for designs that demand large logic resources, significant on-chip RAM, and a high number of I/Os. Its architecture, as documented in the Stratix IV device handbook, provides transceiver and DSP features that support bandwidth- and compute‑intensive system functions.

This part is appropriate for engineering teams building communications equipment, video processing platforms, custom accelerators, or other applications that require integrated logic, memory, and I/O density in a surface‑mount FCBGA package. The device’s specifications support scalable designs and predictable integration into commercial-temperature products.

If you would like pricing or availability information, request a quote or submit a quote for EP4SGX290KF40C3NAB.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up