EP4SGX290KF40C3

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17661952 291200 1517-BBGA, FCBGA

Quantity 1,567 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF40C3 – Stratix® IV GX FPGA — 291,200 logic elements, 744 I/Os

The EP4SGX290KF40C3 is a Stratix® IV GX field-programmable gate array (FPGA) offered by Intel. It provides a high-density programmable fabric with 291,200 logic elements and substantial on-chip memory to address demanding digital system requirements.

Designed for designs that require large logic capacity, wide I/O counts and integrated high-level building blocks, this commercial-grade device targets applications that benefit from on-chip DSP resources, transceiver capability and substantial embedded memory while operating within a 0 °C to 85 °C temperature range.

Key Features

  • Logic Capacity — 291,200 logic elements for implementing large-scale digital designs and complex state machines.
  • Embedded Memory — Approximately 16.8 Mbits of on-chip RAM (17,661,952 total RAM bits) to support buffering, lookup tables and data-path storage.
  • I/O Density — 744 I/O pins to support broad external interfacing and multi-channel connectivity.
  • On-Chip Processing Blocks — Device handbook references DSP block and TriMatrix memory block specifications, enabling integration of signal-processing and matrix memory functions.
  • Transceivers and Clocking — Datasheet sections include transceiver performance and PLL/clock-tree specifications for high-speed serial interfaces and flexible clock management.
  • Configuration & Debug — Includes configuration and JTAG specifications called out in the device documentation for standard programming and test flows.
  • Power and Supply — Core supply range specified at 870 mV to 930 mV to meet the device’s recommended operating conditions.
  • Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting for compact board-level integration.
  • Commercial Grade & Compliance — Commercial grade device with operating range 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High-bandwidth communications equipment — Use the integrated transceiver and clocking resources to implement serial links and protocol bridges.
  • Digital signal processing systems — On-chip DSP blocks and large embedded RAM support real-time filtering, FFTs and other signal-processing pipelines.
  • High-density logic consolidation — Large logic element count enables consolidation of multiple legacy ASICs or CPLD functions into a single FPGA.
  • Multi-I/O control and interfacing — 744 I/Os accommodate extensive sensor arrays, parallel interfaces or multi-channel data acquisition fronts.

Unique Advantages

  • High integration density: 291,200 logic elements and substantial embedded memory reduce external components and simplify system BOMs.
  • Extensive I/O capability: 744 I/O pins enable broad peripheral connectivity and flexible board partitioning.
  • Designed for complex datapaths: On-chip DSP and TriMatrix memory block references in the device documentation support compute-heavy and dataflow-centric designs.
  • Flexible clock and serial support: Documented PLL, clock-tree and transceiver specifications support designs that require precise timing and high-speed serial links.
  • Board-level readiness: FCBGA 1517 package and surface-mount mounting facilitate compact PCB layouts and high-density assemblies.
  • Compliance and commercial suitability: RoHS compliant and rated for 0 °C to 85 °C operation for standard commercial deployments.

Why Choose EP4SGX290KF40C3?

The EP4SGX290KF40C3 delivers a balance of large logic capacity, significant embedded memory and wide I/O bandwidth in a Stratix IV GX FPGA. Its documented on-chip DSP resources, transceiver and clocking features make it suitable for applications that need integrated signal-processing, high-speed interfaces and consolidated logic implementation.

This device is a fit for engineering teams building complex digital systems that require scalability and component consolidation. Backed by the Stratix IV device handbook and detailed datasheet documentation, the EP4SGX290KF40C3 provides verifiable electrical, timing and configuration specifications to support development and deployment in commercial-grade systems.

If you’d like pricing or availability, request a quote or submit a purchase inquiry today and include the part number EP4SGX290KF40C3 in your request.

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