EP4SGX290KF40C2
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17661952 291200 1517-BBGA, FCBGA |
|---|---|
| Quantity | 55 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290KF40C2 – Stratix® IV GX FPGA, 291,200 logic elements
The EP4SGX290KF40C2 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, supplied in a 1517-FBGA (40×40) package and designed for surface-mount assembly. It delivers high logic density with 291,200 logic elements and substantial on-chip RAM for complex, memory-intensive digital designs.
Device documentation for the Stratix IV family highlights transceiver performance, DSP block capability, TriMatrix memory blocks, PLLs and comprehensive electrical and switching characteristics — making this device suitable for designs that require integrated DSP, high-speed serial transceivers, and significant embedded memory and I/O resources.
Key Features
- Logic Capacity 291,200 logic elements provide the capacity for complex programmable logic implementations.
- Embedded Memory Approximately 17.7 Mbits of on-chip RAM (17,661,952 bits) to support buffering, frame storage, and memory-intensive algorithms.
- I/O Resources 744 user I/Os to support dense external interfacing and broad system connectivity.
- High-Speed Transceiver and DSP Support Datasheet listings include transceiver performance specifications and DSP block specifications for designs requiring serial links and signal processing.
- Clocking and Timing Documented PLL and clock tree specifications for flexible clock management and timing architectures.
- Package and Mounting 1517-BBGA / 1517-FBGA (40×40) FCBGA package in a surface-mount form factor for compact board integration.
- Power Core voltage supply range 870 mV to 930 mV, enabling defined power design and supply planning.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant.
- Comprehensive Documentation Device handbook and datasheet coverage include DC/switching characteristics, I/O standard specifications, power consumption, configuration and JTAG, temperature sensing diode, and other detailed device-level specifications.
Typical Applications
- High-speed communications Use the device’s documented transceiver performance and large I/O count to implement serial links and board-level protocol endpoints.
- Signal processing and DSP acceleration Leverage on-chip DSP block specifications and substantial embedded RAM to implement filtering, encoding/decoding, and real-time data paths.
- Memory-intensive logic Employ approximately 17.7 Mbits of embedded memory for frame buffering, packet storage, and application-level caches.
- System integration and prototyping High logic element count and extensive I/O enable complex system integration, bridging multiple subsystems on a single FPGA fabric.
Unique Advantages
- High logic density: 291,200 logic elements support large-scale programmable designs without immediate migration to multi-device solutions.
- Substantial on-chip memory: Approximately 17.7 Mbits of embedded RAM reduces external memory dependency for many buffering and processing tasks.
- Extensive I/O availability: 744 I/Os enable broad peripheral and interface support for complex board-level systems.
- Documented system-level features: Datasheet coverage of PLLs, clock trees, transceivers, DSP blocks and configuration/JTAG options provides the technical detail needed for engineering integration.
- Compact surface-mount package: 1517-FBGA (40×40) package offers a high-density footprint for space-constrained PCBs.
- RoHS compliant: Supports environmental compliance requirements for many commercial products.
Why Choose EP4SGX290KF40C2?
The EP4SGX290KF40C2 combines high logic capacity, a large embedded memory footprint and an extensive I/O complement in a compact FCBGA package. Its datasheet-supported capabilities — including transceiver, DSP, TriMatrix memory and clocking specifications — make it well suited for engineers building complex communication, signal-processing, and system-integration applications.
Produced by Intel and supplied as a commercial-grade FPGA, this device is aimed at design teams who require detailed electrical and performance documentation to validate timing, power and configuration for medium- to high-complexity digital systems.
If you would like pricing or availability information, request a quote or submit an inquiry and our team will respond with a tailored quote and next steps.

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