EP4SGX290KF40C2

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17661952 291200 1517-BBGA, FCBGA

Quantity 55 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF40C2 – Stratix® IV GX FPGA, 291,200 logic elements

The EP4SGX290KF40C2 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, supplied in a 1517-FBGA (40×40) package and designed for surface-mount assembly. It delivers high logic density with 291,200 logic elements and substantial on-chip RAM for complex, memory-intensive digital designs.

Device documentation for the Stratix IV family highlights transceiver performance, DSP block capability, TriMatrix memory blocks, PLLs and comprehensive electrical and switching characteristics — making this device suitable for designs that require integrated DSP, high-speed serial transceivers, and significant embedded memory and I/O resources.

Key Features

  • Logic Capacity  291,200 logic elements provide the capacity for complex programmable logic implementations.
  • Embedded Memory  Approximately 17.7 Mbits of on-chip RAM (17,661,952 bits) to support buffering, frame storage, and memory-intensive algorithms.
  • I/O Resources  744 user I/Os to support dense external interfacing and broad system connectivity.
  • High-Speed Transceiver and DSP Support  Datasheet listings include transceiver performance specifications and DSP block specifications for designs requiring serial links and signal processing.
  • Clocking and Timing  Documented PLL and clock tree specifications for flexible clock management and timing architectures.
  • Package and Mounting  1517-BBGA / 1517-FBGA (40×40) FCBGA package in a surface-mount form factor for compact board integration.
  • Power  Core voltage supply range 870 mV to 930 mV, enabling defined power design and supply planning.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.
  • Comprehensive Documentation  Device handbook and datasheet coverage include DC/switching characteristics, I/O standard specifications, power consumption, configuration and JTAG, temperature sensing diode, and other detailed device-level specifications.

Typical Applications

  • High-speed communications  Use the device’s documented transceiver performance and large I/O count to implement serial links and board-level protocol endpoints.
  • Signal processing and DSP acceleration  Leverage on-chip DSP block specifications and substantial embedded RAM to implement filtering, encoding/decoding, and real-time data paths.
  • Memory-intensive logic  Employ approximately 17.7 Mbits of embedded memory for frame buffering, packet storage, and application-level caches.
  • System integration and prototyping  High logic element count and extensive I/O enable complex system integration, bridging multiple subsystems on a single FPGA fabric.

Unique Advantages

  • High logic density: 291,200 logic elements support large-scale programmable designs without immediate migration to multi-device solutions.
  • Substantial on-chip memory: Approximately 17.7 Mbits of embedded RAM reduces external memory dependency for many buffering and processing tasks.
  • Extensive I/O availability: 744 I/Os enable broad peripheral and interface support for complex board-level systems.
  • Documented system-level features: Datasheet coverage of PLLs, clock trees, transceivers, DSP blocks and configuration/JTAG options provides the technical detail needed for engineering integration.
  • Compact surface-mount package: 1517-FBGA (40×40) package offers a high-density footprint for space-constrained PCBs.
  • RoHS compliant: Supports environmental compliance requirements for many commercial products.

Why Choose EP4SGX290KF40C2?

The EP4SGX290KF40C2 combines high logic capacity, a large embedded memory footprint and an extensive I/O complement in a compact FCBGA package. Its datasheet-supported capabilities — including transceiver, DSP, TriMatrix memory and clocking specifications — make it well suited for engineers building complex communication, signal-processing, and system-integration applications.

Produced by Intel and supplied as a commercial-grade FPGA, this device is aimed at design teams who require detailed electrical and performance documentation to validate timing, power and configuration for medium- to high-complexity digital systems.

If you would like pricing or availability information, request a quote or submit an inquiry and our team will respond with a tailored quote and next steps.

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