EP4SGX290KF40C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 908 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290KF40C3G – * Field Programmable Gate Array (FPGA) IC
The EP4SGX290KF40C3G is an Intel Stratix IV family FPGA device, built for designs that require large programmable logic capacity, abundant I/O, and embedded memory. It implements the Stratix IV GX architecture elements described in the device handbook to support high-speed transceiver features, DSP blocks, and flexible I/O integration.
This commercial-grade, surface-mount FCBGA device is suited to systems that demand significant on-chip resources—such as communications, networking, digital signal processing, and other high-bandwidth applications—while providing a clear hardware resource profile for design planning and procurement.
Key Features
- Logic Capacity Provides 291,200 logic elements for complex digital designs and large-scale programmable functions.
- LAB/CLB Count Includes 11,648 logic array blocks (LABs) to structure and scale logic partitioning and floorplanning.
- Embedded Memory Approximately 17.66 Mbits of on-chip RAM enables large buffering, lookup tables, and memory-intensive processing without external memory for many use cases.
- I/O Density 744 I/O pins to support wide bus interfaces, parallel data lanes, and mixed-signal board-level connectivity.
- Stratix IV Device Family Features Documented family features include high-speed transceiver support, DSP blocks, PLLs, and flexible clock networks as described in the Stratix IV Device Handbook.
- Low-Voltage Core Core voltage supply specified at 870 mV to 930 mV for compatibility with system power architectures that match the device core requirements.
- Package and Mounting 1517-ball FCBGA (1517-FBGA, 40×40) package, surface-mount, designed for dense board integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature, suitable for commercial electronic equipment.
- RoHS Compliant Meets RoHS environmental requirements for restricted substances.
Typical Applications
- High-Speed Communications Used in networking and telecom equipment to implement protocol engines, packet processing, and transceiver-based interfaces leveraging Stratix IV high-speed transceiver features.
- Digital Signal Processing Applies to DSP-heavy systems where on-chip DSP blocks and approximately 17.66 Mbits of embedded RAM accelerate filtering, transforms, and real-time processing.
- Data Acquisition and Aggregation Ideal for multi-channel data capture and aggregation tasks that require large I/O counts (744 I/Os) and substantial on-chip buffering.
- Prototyping and Custom Hardware Fits advanced FPGA-based prototypes and custom hardware accelerators that need large logic resources and flexible I/O mapping.
Unique Advantages
- High Logic Density: 291,200 logic elements give designers the headroom to implement complex state machines, parallel datapaths, and large custom accelerators on a single device.
- Substantial On-Chip Memory: Approximately 17.66 Mbits of embedded memory reduces the need for external RAM in many buffering and lookup scenarios, simplifying BOM and board routing.
- Extensive I/O Capacity: 744 I/Os enable wide bus interfaces, multi-lane signaling, and flexible board-level connectivity without multiplexing compromises.
- Stratix IV Family Capabilities: Family-level features such as high-speed transceivers, DSP blocks, and robust clocking options offer a documented foundation for implementing high-bandwidth and protocol-rich designs.
- Compact Surface-Mount FCBGA: The 1517-FBGA package supports dense PCB integration while providing the pad count required for high I/O and power delivery.
- Commercial Deployment Ready: With a 0 °C to 85 °C rating and RoHS compliance, the device is suitable for commercial electronic product lines that align with these environmental requirements.
Why Choose EP4SGX290KF40C3G?
The EP4SGX290KF40C3G combines the Stratix IV device family architecture with high logic capacity, significant embedded memory, and broad I/O resources to meet demanding design requirements. Its documented family features—such as high-speed transceiver support and DSP resources—make it a practical choice for communications, DSP, and data-intensive applications that need scalable programmable logic and memory on a single chip.
This Intel Stratix IV device is appropriate for engineering teams and procurement groups seeking a commercially graded FPGA with a defined voltage and temperature envelope, a high ball-count FCBGA package for dense integration, and the on-chip resources to consolidate functionality and reduce external components.
Request a quote or submit an inquiry for EP4SGX290KF40C3G to get availability and pricing information for your design planning and procurement needs.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018