EP4SGX290KF40C3N

The EP4SGX290KF40C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA surface-mount package. It delivers high logic capacity, substantial on-chip memory, and extensive I/O connectivity for complex digital designs in commercial applications.

With 291,200 logic elements, approximately 16.8 Mbits of embedded memory and 744 I/O pins, this device targets designs that require dense logic implementation, large embedded RAM resources, and flexible interfacing in a compact BGA footprint.

Key Features

• Core Capacity  291,200 logic elements for implementing complex custom logic and large-scale digital functions.
• Embedded Memory  Total on-chip RAM of 17,661,952 bits (approximately 16.8 Mbits) to support data buffering, look-up tables and embedded storage.
• I/O Resources  744 user I/O pins providing extensive connectivity for parallel interfaces, memory buses, and multi-channel I/O designs.
• Package and Mounting  1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40) in a surface-mount form factor for high pin density and board-level integration.
• Power Supply  Core voltage support in the 0.870 V to 0.930 V range to match modern low-voltage power domains.
• Operating Range  Commercial-grade operating temperature range from 0 °C to 85 °C suitable for standard commercial electronics environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Implement large custom logic blocks and parallel processing pipelines leveraging the device's 291,200 logic elements and abundant embedded RAM.
• Custom I/O and protocol bridging  Use the 744 I/O pins to interface multiple external devices, memory buses, and protocol converters within a single FPGA.
• Platform and system prototyping  Rapidly prototype complex system functions that require significant logic resources and on-chip memory in a compact BGA package.

Unique Advantages

• High logic density: 291,200 logic elements enable implementation of intricate FPGA designs without external logic expansion.
• Significant embedded memory: Approximately 16.8 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O count: 744 I/O pins provide design flexibility for multiple interfaces and high-channel-count systems.
• Compact BGA package: 1517-BBGA (1517-FBGA 40×40) balances pin density with board-area efficiency for space-constrained designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
• RoHS compliant: Meets RoHS requirements for regulatory and manufacturing considerations.

Why Choose EP4SGX290KF40C3N?

The EP4SGX290KF40C3N from Intel's Stratix® IV GX family combines large logic capacity, substantial embedded memory, and broad I/O support in a compact FCBGA package, making it well suited for commercial designs that demand dense logic integration and flexible interfacing. Its commercial-grade operating range and RoHS compliance simplify adoption in mainstream electronics projects.

This FPGA is ideal for engineers and teams building complex digital systems that require on-chip memory and high I/O counts while maintaining a compact board footprint. The part provides a scalable hardware platform for prototyping and production designs where high logic density and embedded RAM are primary requirements.

Request a quote or submit a product inquiry to obtain pricing, availability, and technical purchasing details for the EP4SGX290KF40C3N.