EP4SGX290HF35I3N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17661952 291200 1152-BBGA, FCBGA

Quantity 928 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290HF35I3N – Stratix IV GX FPGA, 291,200 logic elements

The EP4SGX290HF35I3N is a Stratix® IV GX field-programmable gate array (FPGA) IC from Intel. It delivers a large programmable fabric and series-level features for high-bandwidth designs, combining a high logic element count with substantial on-chip RAM and extensive I/O capability.

Targeted at industrial applications, this device is suited for bandwidth-intensive and system-integration use cases that require a high-density FPGA with comprehensive I/O and series features such as high-speed transceivers, DSP blocks, and flexible clocking resources.

Key Features

  • Logic Capacity — 291,200 logic elements to support complex digital designs and large-scale integration needs.
  • Embedded Memory — Approximately 17.66 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic functions.
  • I/O Density — 564 device I/Os to enable broad peripheral and interface connectivity in high-pin-count systems.
  • Series Architecture Features — Stratix IV GX series features referenced in the device handbook include high-speed transceiver support, DSP blocks, PLLs, clock networks, and external memory interface capability for demanding signal-processing and communications tasks.
  • Power Supply — Core voltage range specified at 870 mV to 930 mV to match system power-rail requirements.
  • Thermal and Environmental — Industrial-grade operation with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
  • Package and Mounting — Surface-mount 1152-ball BGA package (supplier device package: 1152-FBGA, 35×35), suitable for high-density PCB layouts.

Typical Applications

  • High-bandwidth communications — Implements protocol-heavy and high-aggregate-bandwidth functions using the Stratix IV GX series transceiver and clocking features.
  • Signal processing and DSP — Large logic capacity and embedded memory support complex digital signal processing pipelines and DSP block utilization.
  • System integration and prototyping — High I/O count and flexible interfacing options enable aggregation of multiple peripherals and external memory interfaces for system-level designs.

Unique Advantages

  • High integration density: 291,200 logic elements and substantial on-chip RAM reduce reliance on external logic and memory, simplifying board-level designs.
  • Extensive I/O count: 564 I/Os enable broad connectivity for multi-interface systems without additional interface bridges.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
  • Robust series feature set: Stratix IV GX family features such as high-speed transceivers, PLLs, and DSP blocks provide architectural building blocks for bandwidth- and timing-sensitive designs.
  • RoHS compliant: Aligned with environmental requirements for lead-free manufacturing processes.

Why Choose EP4SGX290HF35I3N?

The EP4SGX290HF35I3N positions itself as a high-density, industrial-grade Stratix IV GX FPGA that balances large programmable fabric, significant embedded memory, and extensive I/O resources. It is appropriate for engineers building bandwidth-focused or integration-heavy systems who need a device with series-level transceiver, DSP, and clocking capabilities.

With robust thermal range, a compact 1152-ball BGA package, and core voltage specifications clearly defined, this device offers a verifiable platform for long-lived designs requiring scalability, system-level connectivity, and the architectural feature set outlined in the Stratix IV GX device handbook.

Request a quote or submit a pricing inquiry to get availability and order information for EP4SGX290HF35I3N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up