EP4SGX290HF35I4N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17661952 291200 1152-BBGA, FCBGA

Quantity 980 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290HF35I4N – Stratix® IV GX Field Programmable Gate Array (FPGA), 1152-BBGA

The EP4SGX290HF35I4N is a Stratix IV GX FPGA device providing a high-capacity programmable logic fabric with embedded memory, DSP resources and advanced I/O features as described in the Stratix IV Device Handbook. It targets designs that require significant logic density, on-chip RAM and a large number of I/O in an industrial-grade surface-mount FBGA package.

Architected for complex digital systems, the device integrates programmable logic, clock networks and high-speed transceiver and I/O capabilities to support applications requiring substantial on-chip resources and system-level integration.

Key Features

  • Logic Capacity — 291,200 logic elements to implement large-scale combinational and sequential logic designs.
  • Embedded Memory — Approximately 16.8 Mbits of on-chip RAM (17,661,952 total RAM bits) for data buffering, FIFOs and local storage.
  • I/O Density — 564 I/O pins to support broad peripheral and external memory interfacing.
  • High-Speed Fabric and I/O — Device handbook references high-speed transceiver features, external memory interfaces and differential I/O capabilities for high-bandwidth system links.
  • DSP and Clock Resources — Documentation notes integrated DSP blocks, PLLs and extensive clock-network features for timing and signal-processing architectures.
  • Package and Mounting — 1152-BBGA, FCBGA / supplier device package 1152-FBGA (35×35) in a surface-mount form factor for compact system-level integration.
  • Voltage and Temperature — Core supply range 870 mV to 930 mV and industrial operating temperature from −40 °C to 100 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-Speed Communications — Implements high-speed serial links and protocol interfaces using the Stratix IV GX transceiver and differential I/O features.
  • Signal Processing — Leverages embedded DSP blocks and substantial logic capacity for digital filtering, FFTs and real-time data processing pipelines.
  • Memory Interface Controllers — Supports external memory interfaces using abundant I/O and on-chip RAM for buffering and controller logic.
  • Complex Control Systems — Utilizes large logic and clocking resources for motor control, instrumentation control and other industrial automation functions.

Unique Advantages

  • High Logic Density: 291,200 logic elements enable implementation of large, feature-rich designs without external glue logic.
  • Substantial On-Chip Memory: Approximately 16.8 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
  • Extensive I/O: 564 I/O pins provide flexibility for multiple peripheral interfaces and parallel memory buses.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C to meet demanding environmental requirements.
  • Compact FBGA Package: 1152-ball FBGA (1152-BBGA / 1152-FBGA (35×35)) delivers high pin-count in a surface-mount package suitable for space-constrained boards.
  • Standards-Based Documentation: Device functionality and system integration guidance are provided in the Stratix IV Device Handbook and related technical documentation.

Why Choose EP4SGX290HF35I4N?

The EP4SGX290HF35I4N combines large programmable logic capacity, multi-megabit on-chip RAM and a high I/O count in an industrial-grade FBGA package. That combination makes it well suited for engineers building complex communications, signal-processing and control systems that need integrated resources and robust operating-range specifications.

Backed by the Stratix IV device documentation, the EP4SGX290HF35I4N provides a documented platform for system integration, timing architecture and high-speed I/O design, helping teams reduce system BOM and centralize critical logic functions on a single FPGA device.

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