EP4SGX290HF35I4G

The EP4SGX290HF35I4G is an Intel FPGA based on the Stratix IV device family. It provides a high-density programmable fabric with substantial embedded memory and a large I/O complement for complex digital designs.

Designed for industrial applications, this device targets high-throughput signal processing, networking and communications, and advanced control systems where high logic capacity, significant on-chip RAM, and broad operating temperature support are required.

Key Features

• Core density — 291,200 logic elements (cells) to implement large-scale custom logic and system-on-chip functions.
• Embedded memory — approximately 17.66 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O capacity — 564 user I/O pins to support wide external interfacing and multiple parallel buses.
• Package and mounting — 1152-ball FCBGA package (1152-BBGA / 35 × 35) with surface-mount mounting for compact board integration.
• Operating range — Industrial-grade device rated for operation from −40°C to 100°C for deployment across demanding environments.
• Power supply — Core voltage range 870 mV to 930 mV, enabling predictable power planning for system designers.
• Device family reference — Based on Stratix IV architecture as documented in the Stratix IV device handbook, including fabric, clocking, and transceiver feature sets.
• Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-performance networking — Implement packet processing, protocol offload, and custom data-path logic using the device’s high logic density and large I/O count.
• Digital signal processing — Deploy DSP pipelines, video processing, and acceleration blocks leveraging abundant logic elements and on-chip RAM.
• Industrial control and automation — Integrate control algorithms, sensor interfacing, and I/O expansion in harsh environments with the industrial temperature rating.
• Prototype and custom silicon replacement — Use the programmable fabric to validate and iterate complex SoC designs before ASIC commitment.

Unique Advantages

• High logic capacity: 291,200 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 17.66 Mbits of embedded memory reduces the need for external memory in many buffering and scratchpad use cases.
• Large I/O footprint: 564 I/Os provide flexibility for parallel interfaces, external peripherals, and multi-channel I/O architectures.
• Industrial thermal range: −40°C to 100°C operational rating supports deployment in demanding environmental conditions.
• Compact FCBGA package: 1152-ball FCBGA (35×35) offers high integration in a surface-mount form factor suitable for dense PCB layouts.
• Standards-aware supply planning: Defined core voltage range (870–930 mV) simplifies power-supply design and system integration.

Why Choose EP4SGX290HF35I4G?

The EP4SGX290HF35I4G combines high logic capacity, significant embedded memory, and an extensive I/O complement within a compact FCBGA package, making it well suited for complex, high-throughput designs in industrial environments. Its Stratix IV–based architecture delivers the fabric and I/O capabilities required for networking, DSP, and control applications while supporting demanding temperature ranges.

For teams building scalable, integrated digital systems that require a robust programmable platform and clear power and thermal parameters, this device offers a balance of integration, performance headroom, and deployment reliability backed by the Stratix IV device documentation.

Request a quote or submit a sales inquiry for EP4SGX290HF35I4G to receive pricing, lead-time, and availability information tailored to your project requirements.