EP4SGX290HF35I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,276 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290HF35I3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX290HF35I3G is an Intel FPGA from the Stratix IV device family, designed for high-density, high-performance programmable logic applications. It combines a large logic element count, substantial on‑chip RAM, and a high I/O count in a BGA package targeted at industrial-temperature deployments.
Typical markets include high-speed communications, advanced signal processing, and complex system integration where logic capacity, transceiver capability described in the Stratix IV handbook, and robust thermal performance are required.
Key Features
- Stratix IV GX family architecture Device is part of the Stratix IV series as documented in the Stratix IV Device Handbook, providing architecture-level features for high-bandwidth and protocol support.
- Logic capacity Approximately 291,200 logic elements, enabling large-scale custom logic and complex finite-state or datapath implementations.
- Embedded memory Approximately 17.66 Mbits of embedded memory (17,661,952 total RAM bits) to support FIFOs, buffering, and on-chip data storage.
- I/O density 564 I/Os to support extensive external interfaces and parallel connectivity for multi-channel systems.
- High-speed transceiver and protocol support Stratix IV GX device family features include high-speed transceiver capabilities and broad protocol support as described in the device handbook, suitable for high-throughput links.
- Signal integrity and diagnostic features Device family-level provisions for signal integrity and diagnostic tools are documented in the Stratix IV handbook to aid system reliability and debug.
- Package and mounting 1152‑FBGA (35 × 35) FCBGA package, surface-mount, suitable for compact board-level implementations.
- Power and operating range Core supply range specified between 870 mV and 930 mV, with an operating temperature range of −40 °C to 100 °C and industrial-grade designation.
- RoHS compliant Environmentally compliant per the provided RoHS status.
Typical Applications
- High-speed communications Use the device’s Stratix IV GX transceiver capabilities and large logic fabric for line cards, backplane interfaces, and protocol bridging in communications equipment.
- Digital signal processing Implement multi-channel DSP pipelines and real-time filtering using the device’s logic density and embedded memory for buffering and sample storage.
- Networking and data aggregation Deploy in switches, routers, and aggregation systems where high I/O count and substantial on-chip memory support packet processing and packet buffering.
- Instrumentation and test systems Leverage the high I/O density and programmable logic for custom measurement front-ends, data capture, and protocol conversion in industrial test equipment.
Unique Advantages
- High logic and memory integration: Approximately 291,200 logic elements paired with ~17.66 Mbits of embedded memory reduce the need for external RAM and simplify board-level design.
- Extensive I/O support: 564 I/Os provide flexibility for multi-channel interfaces, parallel buses, and dense connector requirements.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in demanding or uncontrolled thermal environments.
- Compact, production-ready package: 1152‑FBGA (35×35) FCBGA in a surface-mount form factor enables high-density PCB layouts for space-constrained systems.
- Documented family-level features: Stratix IV device handbook details architecture-level capabilities such as high-speed transceivers, clock networks, PLLs, DSP blocks, and I/O features that apply to this device family.
- Regulatory compliance: RoHS compliance for environmental and manufacturing consistency.
Why Choose EP4SGX290HF35I3G?
The EP4SGX290HF35I3G delivers a combination of high logic density, substantial on-chip memory, and broad I/O capability within the Stratix IV family architecture, making it well suited for high-throughput communications, signal processing, and complex system integration at industrial temperatures. Designers benefit from family-level architectural features documented in the Stratix IV handbook to address high-speed link requirements and advanced system timing.
This part is aimed at engineering teams developing robust, high-performance FPGA-based solutions that require a balance of programmable logic, embedded memory, and comprehensive I/O in a production-ready package backed by Intel’s Stratix IV documentation.
Request a quote or submit an inquiry for EP4SGX290HF35I3G to receive pricing and availability details tailored to your project requirements.

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