EP4SGX290HF35I3G

IC FPGA 564 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,276 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290HF35I3G – Field Programmable Gate Array (FPGA) IC

The EP4SGX290HF35I3G is an Intel FPGA from the Stratix IV device family, designed for high-density, high-performance programmable logic applications. It combines a large logic element count, substantial on‑chip RAM, and a high I/O count in a BGA package targeted at industrial-temperature deployments.

Typical markets include high-speed communications, advanced signal processing, and complex system integration where logic capacity, transceiver capability described in the Stratix IV handbook, and robust thermal performance are required.

Key Features

  • Stratix IV GX family architecture  Device is part of the Stratix IV series as documented in the Stratix IV Device Handbook, providing architecture-level features for high-bandwidth and protocol support.
  • Logic capacity  Approximately 291,200 logic elements, enabling large-scale custom logic and complex finite-state or datapath implementations.
  • Embedded memory  Approximately 17.66 Mbits of embedded memory (17,661,952 total RAM bits) to support FIFOs, buffering, and on-chip data storage.
  • I/O density  564 I/Os to support extensive external interfaces and parallel connectivity for multi-channel systems.
  • High-speed transceiver and protocol support  Stratix IV GX device family features include high-speed transceiver capabilities and broad protocol support as described in the device handbook, suitable for high-throughput links.
  • Signal integrity and diagnostic features  Device family-level provisions for signal integrity and diagnostic tools are documented in the Stratix IV handbook to aid system reliability and debug.
  • Package and mounting  1152‑FBGA (35 × 35) FCBGA package, surface-mount, suitable for compact board-level implementations.
  • Power and operating range  Core supply range specified between 870 mV and 930 mV, with an operating temperature range of −40 °C to 100 °C and industrial-grade designation.
  • RoHS compliant  Environmentally compliant per the provided RoHS status.

Typical Applications

  • High-speed communications  Use the device’s Stratix IV GX transceiver capabilities and large logic fabric for line cards, backplane interfaces, and protocol bridging in communications equipment.
  • Digital signal processing  Implement multi-channel DSP pipelines and real-time filtering using the device’s logic density and embedded memory for buffering and sample storage.
  • Networking and data aggregation  Deploy in switches, routers, and aggregation systems where high I/O count and substantial on-chip memory support packet processing and packet buffering.
  • Instrumentation and test systems  Leverage the high I/O density and programmable logic for custom measurement front-ends, data capture, and protocol conversion in industrial test equipment.

Unique Advantages

  • High logic and memory integration: Approximately 291,200 logic elements paired with ~17.66 Mbits of embedded memory reduce the need for external RAM and simplify board-level design.
  • Extensive I/O support: 564 I/Os provide flexibility for multi-channel interfaces, parallel buses, and dense connector requirements.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in demanding or uncontrolled thermal environments.
  • Compact, production-ready package: 1152‑FBGA (35×35) FCBGA in a surface-mount form factor enables high-density PCB layouts for space-constrained systems.
  • Documented family-level features: Stratix IV device handbook details architecture-level capabilities such as high-speed transceivers, clock networks, PLLs, DSP blocks, and I/O features that apply to this device family.
  • Regulatory compliance: RoHS compliance for environmental and manufacturing consistency.

Why Choose EP4SGX290HF35I3G?

The EP4SGX290HF35I3G delivers a combination of high logic density, substantial on-chip memory, and broad I/O capability within the Stratix IV family architecture, making it well suited for high-throughput communications, signal processing, and complex system integration at industrial temperatures. Designers benefit from family-level architectural features documented in the Stratix IV handbook to address high-speed link requirements and advanced system timing.

This part is aimed at engineering teams developing robust, high-performance FPGA-based solutions that require a balance of programmable logic, embedded memory, and comprehensive I/O in a production-ready package backed by Intel’s Stratix IV documentation.

Request a quote or submit an inquiry for EP4SGX290HF35I3G to receive pricing and availability details tailored to your project requirements.

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