EP4SGX290HF35C4

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17661952 291200 1152-BBGA, FCBGA

Quantity 522 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290HF35C4 – Stratix® IV GX FPGA, 291,200 logic elements, 564 I/O (1152-BBGA)

The EP4SGX290HF35C4 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, supplied in a 1152-BBGA (35 × 35 mm) package for surface-mount assembly. This device delivers high logic capacity and dense I/O, making it suitable for complex digital designs where large-scale programmable logic and on-chip memory are required.

Key architectural attributes include 291,200 logic elements, approximately 16.8 Mbits of embedded RAM, and 564 I/O pins. These characteristics support applications that demand significant logic resources, large embedded memory, and extensive external interfacing while operating within a commercial temperature range.

Key Features

  • Logic Capacity  Provides 291,200 logic elements to implement high-density digital designs and complex custom logic functions.
  • Embedded Memory  Approximately 16.8 Mbits of on-chip RAM (17,661,952 total RAM bits) for buffering, lookup tables, and local data storage.
  • I/O Resources  564 I/O pins delivered in the 1152-BBGA package to support broad external connectivity and dense board-level interfacing.
  • Power and Core Voltage  Core supply specified from 870 mV to 930 mV, enabling predictable power design and supply planning for the FPGA core.
  • Package & Mounting  1152-ball BGA (FBGA, 35 × 35 mm) surface-mount package suited for compact, high-density board layouts.
  • Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformity.
  • Documented Series-Level Capabilities  The Stratix IV device handbook and datasheet content include sections covering electrical characteristics, PLL specifications, transceiver performance, DSP block specifications, clock tree and core performance—reference materials useful for design validation and system integration.

Typical Applications

  • High-density digital systems  Leverages 291,200 logic elements and approximately 16.8 Mbits of embedded RAM to realize complex state machines, data pipelines, and custom accelerators.
  • Board-level signal interfacing  564 I/O pins in a compact 1152-BBGA package support designs requiring many external connections such as multi-channel data aggregation or dense connector interfaces.
  • Embedded memory-dependent designs  On-chip RAM supports buffering, packet storage, and lookup table implementations that reduce external memory bandwidth requirements.

Unique Advantages

  • High logic density: 291,200 logic elements enable integration of large FPGA designs without partitioning across multiple devices, reducing system complexity.
  • Substantial on-chip RAM: Approximately 16.8 Mbits of embedded memory helps minimize reliance on external memory for many intermediate storage needs, simplifying board design.
  • Extensive I/O count: 564 I/O pins provide flexible connectivity options for complex multi-interface systems and high channel-count applications.
  • Compact BGA footprint: 1152-ball FCBGA (35 × 35 mm) supports high-density board layouts while maintaining robust soldered connections for production assemblies.
  • Predictable power planning: Specified core voltage range (870 mV–930 mV) assists in precise power-supply design and thermal budgeting.
  • Commercial-grade availability: Device rated for 0 °C to 85 °C operation and RoHS compliant for mainstream product deployments.

Why Choose EP4SGX290HF35C4?

The EP4SGX290HF35C4 positions itself as a high-capacity Stratix IV GX FPGA option for engineers and procurement teams seeking substantial programmable logic, abundant embedded RAM, and a large I/O complement in a compact BGA package. Its documented device handbook coverage (including electrical characteristics, PLLs, transceiver and DSP block specifications) supports detailed design verification and system-level planning.

This device is well suited for designs that require scalable logic resources and dense interfacing within a commercial temperature envelope, and for teams that rely on detailed manufacturer documentation to validate performance and integration requirements over the product lifecycle.

Request a quote or submit an availability inquiry to evaluate EP4SGX290HF35C4 for your next design or production run.

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