EP4SGX290HF35C3

The EP4SGX290HF35C3 is an Intel Stratix IV GX field-programmable gate array supplied in a high-density 1152-ball FBGA package. It integrates a large programmable fabric with substantial embedded RAM and a high I/O count to support complex digital designs.

Designed for applications that require significant logic capacity, on-chip memory and broad interface capability, this device targets systems that implement high-speed serial links, DSP-centric pipelines and external memory interfaces while operating within a commercial temperature range.

Key Features

• Architecture — Stratix IV GX Device family features such as high-speed transceiver support and a fabric architecture suitable for high aggregate data bandwidth and protocol support as documented in the Stratix IV device handbook.
• Logic Capacity 291,200 logic elements to implement large-scale custom logic, state machines and data-paths.
• Embedded Memory Approximately 17.66 Mbits of on-chip RAM for buffering, packet storage and intermediate data storage in DSP/dataflow applications.
• I/O Density 564 I/O pins to interface with external devices, memory and high-speed serial endpoints.
• Package & Mounting 1152-ball FBGA (35×35) supplier package; package case listed as 1152-BBGA, FCBGA. Surface-mount device for compact board implementations.
• Power Supply Operates from a core supply range of 870 mV to 930 mV, allowing designs to target the specified device core voltage window.
• Temperature Grade Commercial operating temperature range, 0 °C to 85 °C, suitable for standard commercial electronic products.
• Compliance RoHS compliant for regulatory alignment in lead-free manufacturing environments.

Typical Applications

• High-speed serial interfaces — Implement protocol endpoints and bridging logic that leverage the Stratix IV GX transceiver features and high aggregate data bandwidth described in the device handbook.
• DSP and signal processing pipelines — Use the device’s large logic capacity and embedded memory for streaming DSP blocks, filtering and real-time data manipulation.
• External memory controllers — Implement controllers and buffering for external memory interfaces, using the on-chip RAM for packet/transaction buffering.
• System prototyping and custom SoC glue logic — Integrate custom peripherals, protocol adaptation and timing control where high I/O count and logic density are required.

Unique Advantages

• High logic density: 291,200 logic elements provide the capacity to implement complex state machines, wide datapaths and large combinational logic blocks.
• Significant on-chip RAM: Approximately 17.66 Mbits of embedded memory reduces dependence on external RAM for intermediate storage and buffering.
• Large I/O complement: 564 I/Os enable broad external interfacing without immediate need for additional I/O expanders.
• Compact, surface-mount package: 1152-ball FBGA (35×35) packaging allows high-density board designs while keeping the device surface-mount compatible.
• Defined commercial operating range: Specified 0 °C to 85 °C operating temperature and core supply range (870 mV–930 mV) allow predictable design margins for commercial deployments.
• RoHS compliant: Supports lead-free manufacturing processes and environmental compliance requirements.

Why Choose EP4SGX290HF35C3?

The EP4SGX290HF35C3 combines a Stratix IV GX architecture with high logic capacity, substantial on-chip memory and a broad I/O complement in a 1152-ball FBGA surface-mount package. It is positioned for designs that require integrated DSP capability, extensive interfacing and high aggregate data handling within a commercial temperature envelope.

Engineers designing networked equipment, DSP-heavy systems or complex prototyping platforms will find the device’s combination of logic density, embedded RAM and documented transceiver and I/O features suitable for advanced mid-to-high complexity applications. The device’s specification set supports scalable designs that align with Intel’s Stratix IV device documentation and design ecosystem.

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