EP4SGX290HF35C2

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17661952 291200 1152-BBGA, FCBGA

Quantity 580 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290HF35C2 – Stratix IV GX FPGA, 291,200 logic elements, 1152‑FBGA (35×35)

The EP4SGX290HF35C2 is a Stratix IV GX field‑programmable gate array (FPGA) offered in a 1152‑ball FCBGA package. It provides a high‑capacity programmable fabric with abundant I/O and on‑chip memory for designs that require large logic density and extensive connectivity.

Targeted at applications that leverage high aggregate data bandwidth and complex system integration, this device combines the Stratix IV family architecture with features documented for GX devices, enabling use in high‑speed digital processing, protocol handling and external memory interfaces.

Key Features

  • Core logic  291,200 logic elements provide significant programmable capacity for complex digital designs and custom system functions.
  • Embedded memory  Approximately 17.66 Mbits of on‑chip RAM supports buffering, packet processing and intermediate data storage without immediate reliance on external memory.
  • I/O and connectivity  564 I/O pins accommodate broad peripheral and interface requirements for multi‑lane and multi‑device systems.
  • High‑speed transceiver features  Stratix IV GX device family documentation highlights high‑speed transceiver capabilities and wide protocol support for demanding serial links and external memory interfaces.
  • DSP and timing resources  Device family references include digital signal processing blocks, rich clock networks and PLLs to support high‑performance signal processing and timing architectures.
  • Package and mounting  1152‑FBGA (35×35) FCBGA package, surface‑mount construction for compact, board‑level integration.
  • Power  Specified core voltage range of 870 mV to 930 mV for the device supply.
  • Operating range and grade  Commercial grade with operating temperature 0°C to 85°C; RoHS compliant.

Typical Applications

  • High‑speed networking equipment  Used where high aggregate data bandwidth and Stratix IV GX transceiver features enable multi‑lane serial links and protocol handling.
  • Data acquisition and processing  Large logic capacity and substantial on‑chip RAM support real‑time capture, buffering and preprocessing of high‑rate data streams.
  • Video and image processing  Ample logic elements and embedded memory allow for implementation of custom pipelined processing, scaling and interface logic.
  • External memory interface controllers  Device family features and I/O density suit designs that implement complex external memory interfaces and bridging functions.

Unique Advantages

  • High programmable capacity: 291,200 logic elements give designers the headroom to implement large custom logic blocks and multi‑function systems on a single device.
  • Significant on‑chip memory: Approximately 17.66 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
  • Extensive I/O availability: 564 I/O pins provide flexibility for multi‑channel interfaces, enabling dense connectivity and board‑level consolidation.
  • Designed for high‑speed links: Stratix IV GX family features documented for high‑speed transceivers and wide protocol support help implement demanding serial communications and external memory interfaces.
  • Compact board integration: 1152‑FBGA (35×35) surface‑mount package simplifies placement in space‑constrained designs while supporting high pin‑count connectivity.
  • Compliance and commercial readiness: Commercial grade device with RoHS compliance, and a defined operating range of 0°C to 85°C for mainstream application deployment.

Why Choose EP4SGX290HF35C2?

The EP4SGX290HF35C2 combines a substantial logic fabric, sizable embedded memory and a high I/O count in a single Stratix IV GX FPGA package. These documented attributes make it suitable for designs that require integrated processing, complex protocol support and extensive interfacing without immediately adding external programmable logic.

Its combination of architecture features (as outlined for the Stratix IV family), commercial operating range, and RoHS compliance make this part appropriate for engineering teams and procurement looking for a high‑capacity FPGA solution with documented high‑speed and system‑integration capabilities.

Request a quote or submit an RFQ to receive pricing and availability information for the EP4SGX290HF35C2.

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