EP4SGX290FH29I3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 17661952 291200 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,361 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 289 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290FH29I3N – Stratix® IV GX Field Programmable Gate Array (FPGA)
The EP4SGX290FH29I3N is a Stratix IV GX family Field Programmable Gate Array (FPGA) in a 780-ball BGA package designed for performance-oriented, programmable system designs. It delivers a large logic fabric, substantial embedded RAM, and a high I/O count for complex digital processing, system integration, and high-density interfacing needs.
This device is specified for industrial-grade operation with a core supply window of 870 mV to 930 mV and an operating temperature range from −40 °C to 100 °C, making it suitable for deployments that require extended temperature tolerance and RoHS-compliant manufacturing.
Key Features
- High Logic Capacity — Provides 291,200 logic elements to support large-scale digital designs and complex programmable logic implementations.
- Embedded Memory — Approximately 17.66 Mbits of on-chip RAM to store data, buffers, and intermediate processing states without external memory dependency.
- Extensive I/O — 289 I/O pins to enable high-density external interfacing and flexible board-level connections.
- Core Power — Core voltage supply range of 870 mV to 930 mV, enabling defined power-domain design and management.
- Package & Mounting — 780-ball BGA (FCBGA / supplier device package 780-HBGA, 33 × 33) in a surface-mount format for compact, high-density PCB integration.
- Industrial Temperature Grade — Rated for −40 °C to 100 °C operation for use in temperature-demanding applications.
- RoHS Compliant — Conforms to RoHS regulations for environmentally responsible manufacturing.
- Family-Level Capabilities (Stratix IV) — Device documentation for the Stratix IV family includes specifications for transceivers, PLLs, DSP blocks, TriMatrix memory blocks, and configuration/JTAG features, enabling advanced clocking, high-speed serial interfaces, signal processing blocks, and memory architectures.
Typical Applications
- High-Density Data Processing — Use the large logic and embedded memory capacity for packet processing, data aggregation, and custom compute kernels.
- Communications & Networking — The device’s I/O density and Stratix IV family transceiver/clocking features support high-channel-count interfacing and network functions.
- Signal Processing — Leverage abundant logic elements and on-chip RAM for DSP pipelines and real-time data manipulation.
- System Integration & Prototyping — Combine logic capacity, memory, and numerous I/Os to consolidate multiple functions onto a single FPGA for board-level integration and proof-of-concept platforms.
Unique Advantages
- Substantial Logic Resources: 291,200 logic elements enable implementation of large custom architectures without frequent partitioning across devices.
- Significant On-Chip Memory: Approximately 17.66 Mbits of embedded RAM reduces dependence on external memory and helps lower system BOM complexity.
- High I/O Count: 289 I/Os provide connectivity headroom for dense peripheral and interface requirements.
- Robust Thermal Range: −40 °C to 100 °C operation supports industrial environments and extended temperature applications.
- Compact, High-Density Package: 780-ball BGA (33 × 33) surface-mount package supports compact PCB footprints while offering numerous I/O and power connections.
- Proven Family-Level Features: Stratix IV device documentation details transceivers, PLLs, DSP and TriMatrix memory blocks, and configuration/JTAG support to accelerate system design and verification.
Why Choose EP4SGX290FH29I3N?
The EP4SGX290FH29I3N combines a high logic count, substantial embedded RAM, and a large I/O complement in an industrial-temperature, RoHS-compliant BGA package. It is positioned for engineers and system designers who need a programmable platform capable of consolidating complex digital logic, on-chip memory, and dense external connectivity into a single device footprint.
This part is suited for designs that demand scalable logic resources and integrated memory while maintaining defined core power requirements and the extended temperature range expected for industrial-grade deployments. The Stratix IV family documentation provides supplementary configuration, clocking, transceiver, DSP, and memory architecture guidance to support development and deployment.
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