EP4SGX290FH29I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 32 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 289 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290FH29I4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX290FH29I4G is an Intel FPGA offering dense programmable logic and on‑chip resources optimized for high‑bandwidth and compute‑intensive designs. It is built on an architecture that provides extensive logic fabric, embedded memory, DSP capabilities and advanced I/O features suitable for communications, video processing, and high‑performance embedded systems.
This device is specified for industrial use and combines a large logic capacity with a high I/O count and FCBGA/HBGA packaging options, making it appropriate for systems that require scalable logic, substantial local memory, and robust thermal operating range.
Key Features
- Logic Capacity — 291,200 logic elements to implement complex digital logic, state machines and custom accelerators.
- Embedded Memory — Approximately 17.7 Mbits of on‑chip RAM for frame buffers, FIFOs, and local data storage close to the logic fabric.
- I/O and Connectivity — 289 user I/O pins to interface with external devices, memories, and high‑speed peripherals.
- High‑Speed Transceiver and Protocol Support (Series Level) — Device family documentation references high‑speed transceiver features and broad protocol support for high aggregate data bandwidth applications.
- DSP and Clock Resources (Series Level) — Architecture includes digital signal processing blocks and extensive clock/PLL resources to support timing, clocking and signal processing needs.
- Power Supply — Core supply range from 0.87 V to 0.93 V supporting the device’s core power requirements.
- Package and Mounting — Available in 780‑ball FCBGA/BBGA packages; supplier device package listed as 780‑HBGA (33×33). Surface‑mount mounting type.
- Industrial Temperature Rating — Operating range from −40 °C to 100 °C for industrial environments.
- RoHS Compliant — Device meets RoHS requirements.
Typical Applications
- High‑Performance Networking — Implement packet processing, protocol bridging and aggregation logic where high logic density and many I/Os are required.
- Telecommunications Infrastructure — Use for line cards, backplane interfacing and high‑bandwidth datapath functions leveraging the family’s transceiver and protocol features.
- Video and Imaging Systems — Local embedded memory and DSP resources make the device suitable for frame buffering, image preprocessing and real‑time video pipelines.
- Embedded Compute Acceleration — Offload compute kernels and custom accelerators in edge and server‑adjacent applications that need scalable programmable logic.
Unique Advantages
- High Logic Density: 291,200 logic elements provide the capacity to implement large, complex designs or multiple function blocks on a single device.
- Substantial On‑Chip Memory: Approximately 17.7 Mbits of embedded RAM reduces external memory dependence and supports low‑latency buffering and local data processing.
- Extensive I/O Count: 289 user I/Os enable flexible interfacing to peripherals, memories and board‑level interconnects without extensive multiplexing.
- Industrial‑Grade Operation: Specified for −40 °C to 100 °C operation for deployment in industrial environments that require extended temperature tolerance.
- Robust Packaging Options: 780‑ball FCBGA / HBGA (33×33) packaging supports dense pinout and surface‑mount board assembly for compact, high‑pin‑count designs.
- Defined Core Voltage Range: Core supply specification of 0.87–0.93 V enables predictable power design and supply planning on system BOMs.
Why Choose EP4SGX290FH29I4G?
The EP4SGX290FH29I4G positions itself as a high‑capacity, industrial‑rated FPGA suited for designs that demand a combination of large programmable logic resources, significant embedded memory, and a high count of user I/Os. Its package density and specified operating range make it appropriate for compact, board‑level systems used in communications, imaging and compute acceleration.
For engineering teams targeting scalable, field‑programmable hardware with measurable on‑chip resources and clear electrical and thermal specifications, this device delivers a verifiable platform for development and deployment with vendor documentation available for system integration and transceiver/protocol considerations.
Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX290FH29I4G and support for design‑in and procurement planning.

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