EP4SGX290FH29I3

The EP4SGX290FH29I3 is a Stratix IV GX field programmable gate array (FPGA) IC by Intel, designed for high-density logic and embedded memory applications. With 291,200 logic elements and approximately 17.66 Mbits of on-chip RAM, it targets designs that require substantial programmable logic, large embedded memory, and hundreds of I/O connections.

This device is supplied in a 780-ball FCBGA package, supports surface-mount assembly, and is graded for industrial use with an operating range from -40 °C to 100 °C and a nominal core supply range of 870 mV to 930 mV.

Key Features

• Core Logic Capacity — 291,200 logic elements provide high-density programmable resources for complex digital designs.
• Embedded Memory — Approximately 17.66 Mbits of total on-chip RAM to support buffering, data storage, and intermediate processing without external memory.
• I/O Resources — 289 general-purpose I/O pins to connect to multiple peripherals, interfaces, and system components.
• Power Supply — Core voltage support from 870 mV to 930 mV to match targeted power-domain designs and core-voltage requirements.
• Package & Mounting — 780-BBGA (FCBGA) package, supplier device package listed as 780-HBGA (33×33), optimized for surface-mount assembly and compact board integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
• Standards Compliance — RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

• High-density digital systems — Use the device where large logic capacity is required for custom accelerators, protocol processing, or complex state machines.
• Memory-intensive designs — Leverage approximately 17.66 Mbits of embedded RAM for buffering, packet queues, or on-chip data manipulation without relying solely on external memory.
• I/O-rich systems — Deploy in applications that require extensive peripheral interfacing or multiple parallel data channels using the 289 I/O pins.
• Industrial control and automation — Industrial temperature rating and robust packaging make it suitable for control systems and factory automation where extended temperature operation is required.

Unique Advantages

• High logic density: 291,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM reduces dependence on external memory and improves data-path latency.
• Extensive I/O count: 289 I/Os support complex system interfacing and parallel data channels without external multiplexing.
• Industrial-ready thermal range: -40 °C to 100 °C operation supports deployment in demanding environments.
• Compact BGA packaging: 780-ball FCBGA (33×33) provides a high pin count in a compact footprint for space-constrained boards.
• RoHS compliant: Meets lead-free environmental requirements for modern electronics manufacturing.

Why Choose EP4SGX290FH29I3?

The EP4SGX290FH29I3 combines substantial logic resources, abundant embedded memory, and a high I/O count in a single Stratix IV GX FPGA from Intel. Its industrial temperature rating and compact 780-BBGA package make it a practical choice for engineers building high-density, memory-intensive, and I/O-rich systems that must operate reliably across a wide temperature range.

Designed for projects that demand integration and scalability, this FPGA is suited to teams seeking a high-capacity programmable platform backed by a well-known manufacturer.

Request a quote or submit an inquiry to check pricing and availability for EP4SGX290FH29I3 and to discuss how this FPGA can meet your design requirements.