EP4SGX290FH29C4

The EP4SGX290FH29C4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package. It delivers high logic density and on‑chip memory capacity in a surface‑mount BGA footprint suitable for commercial‑grade designs.

With 291,200 logic elements, approximately 16.8 Mbits of embedded memory and up to 289 I/Os, this device targets complex digital designs that require large programmable logic fabrics, extensive embedded RAM, and broad I/O connectivity while operating within a commercial temperature range.

Key Features

• Core Logic  291,200 logic elements provide a large programmable fabric for complex logic and system integration.
• Logic Structure  11,648 CLB/LAB equivalent structures (reported as Number Of Labs Clbs) for organized placement and routing of logic functions.
• Embedded Memory  Approximately 16.8 Mbits of on‑chip RAM (17,661,952 total RAM bits) to support buffers, FIFOs and data‑intensive algorithms.
• I/O Connectivity  Up to 289 I/O pins to interface with external peripherals, memory and system buses.
• Package & Mounting  780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33). Surface‑mount construction simplifies PCB integration.
• Power  Specified operating supply range: 870 mV to 930 mV, enabling predictable core supply planning.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0°C to 85°C.
• Standards & Compliance  RoHS compliant, supporting lead‑free assembly and regulatory requirements.
• Device Family Features (Refer to Device Handbook)  Stratix IV device handbook includes specifications for transceivers, PLLs, DSP blocks, TriMatrix memory blocks, configuration and JTAG — detailed performance and block‑level information is available in the device documentation.

Typical Applications

• High‑density digital processing Use the 291,200 logic elements and embedded RAM to implement complex signal processing and control logic.
• Interface aggregation Leverage up to 289 I/Os to connect multiple peripherals, memory interfaces or custom bus architectures.
• Embedded memory‑heavy designs Approximately 16.8 Mbits of on‑chip RAM supports buffering, packet processing and temporary data storage without external RAM for some functions.

Unique Advantages

• High logic density: 291,200 logic elements enable consolidation of multi‑function logic into a single device, reducing board‑level component count.
• Large on‑chip memory: Approximately 16.8 Mbits of embedded RAM supports data‑intensive functions and lowers dependency on external memory for many use cases.
• Extensive I/O capacity: Up to 289 I/Os provide flexibility for system partitioning, peripheral interfacing and custom connectivity.
• Compact BGA package: 780‑ball FCBGA (780‑HBGA / 33×33) offers a high‑density package suitable for space‑constrained PCBs while supporting surface‑mount assembly.
• Predictable power envelope: Defined supply range of 870 mV–930 mV aids board power budgeting and core regulator selection.
• Commercial temperature rating and RoHS compliance: Suited for mainstream embedded and communications equipment while meeting environmental compliance requirements.

Why Choose EP4SGX290FH29C4?

The EP4SGX290FH29C4 positions itself as a high‑density Stratix IV GX FPGA option for designers needing significant programmable logic, substantial on‑chip RAM and broad I/O in a BGA package. Its combination of 291,200 logic elements, approximately 16.8 Mbits of embedded memory and 289 I/Os supports complex digital systems where integration and on‑device resources matter.

For teams developing commercial‑grade systems that require a proven device family, documented device‑level features such as transceiver and DSP block specifications in the Stratix IV handbook provide a detailed technical foundation for system design and verification.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time information for the EP4SGX290FH29C4.