EP4SGX290FH29C3N

The EP4SGX290FH29C3N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel. It delivers high logic density and substantial on-chip memory in a surface-mount 780-BBGA (33 × 33) FCBGA package, supporting designs that require large programmable logic resources and extensive I/O.

Key characteristics include 291,200 logic elements, approximately 17.66 Mbits of embedded RAM, and 289 I/O pins, making this device suitable for applications that consolidate logic, memory, and I/O in a compact package while operating within a commercial temperature range.

Key Features

• Core Logic 291,200 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 17.66 Mbits of on-chip RAM support large buffer, cache, and state-storage requirements.
• I/O Density 289 I/O pins enable rich external connectivity for interfacing with peripherals and other system components.
• Power Core voltage supported from 870 mV to 930 mV for devices designed around the specified supply window.
• Package & Mounting 780-BBGA FCBGA, supplier package 780-HBGA (33×33), surface-mount for high-density board integration.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom logic acceleration — Use the large logic element count to implement application-specific accelerators and custom datapaths.
• Memory-intensive designs — Leverage approximately 17.66 Mbits of embedded RAM for buffering, packet queues, and on-chip storage.
• I/O-rich system integration — Support complex board-level interfaces and peripheral connectivity with 289 I/O pins.
• Compact, high-density boards — The 780-BBGA surface-mount package enables high-density PCB layouts for space-constrained systems.

Unique Advantages

• High logic density: 291,200 logic elements enable consolidation of multiple functions into a single device, reducing component count.
• Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM helps minimize external memory needs and improves data locality.
• Extensive I/O capability: 289 I/O pins provide flexibility for interfacing and system expansion without additional bridging logic.
• Compact package footprint: 780-BBGA (33×33) FCBGA surface-mount package supports high-density board designs and efficient use of PCB area.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV accommodates designs targeting lower-voltage domains.
• RoHS compliant: Conforms to RoHS requirements for environmental regulatory needs.

Why Choose EP4SGX290FH29C3N?

The EP4SGX290FH29C3N combines large programmable logic capacity, significant embedded memory, and a high I/O count in a compact 780-BBGA FCBGA package, making it well suited for designs that need to integrate complex logic, buffering, and extensive external connectivity on a single device. As a commercial-grade FPGA from Intel, it provides a robust platform for projects that operate within a 0 °C to 85 °C temperature range and require RoHS compliance.

Choose EP4SGX290FH29C3N when your design demands high logic density, substantial on-chip RAM, and a wide I/O complement in a board-friendly surface-mount package.

Request a quote or submit an inquiry to purchase EP4SGX290FH29C3N and evaluate how its logic density, embedded memory, and I/O capabilities can meet your project requirements.