EP4SGX290FH29C2XG

The EP4SGX290FH29C2XG is a Field Programmable Gate Array (FPGA) IC from Intel built on the Stratix IV device family architecture. It delivers high logic density and on-chip memory capacity for high-bandwidth digital designs.

With 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 289 I/O, this commercial‑grade, surface‑mount FPGA targets applications that require substantial integration of logic, memory, and I/O within a compact BGA package.

Key Features

• Core Logic 291,200 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory Approximately 17.66 Mbits of total on‑chip RAM (17,661,952 bits) for buffering, packet storage, and on‑die data structures.
• I/O Capacity 289 I/O pins provide broad connectivity for parallel interfaces, control signals, and external peripherals.
• Stratix IV Family Features Based on the Stratix IV device family (Stratix IV Device Handbook), with device‑level capabilities including high‑speed transceiver features, wide protocol support, and high aggregate data bandwidth as documented in the device handbook.
• Power and Voltage Core voltage range of 870 mV to 930 mV to match system power rails and core power budgets.
• Package & Mounting 780‑BBGA FCBGA package (supplier device package: 780‑HBGA, 33×33); surface‑mount for PCB assembly.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Compliance RoHS compliant for environmentally regulated designs.

Typical Applications

• High‑performance Networking & Telecom Large logic capacity and abundant I/O enable packet processing, protocol bridging, and line‑rate data handling.
• Data Acceleration & Compute Offload On‑chip memory and high logic density support custom accelerators and inline data processing functions.
• Video and Imaging Systems Ample embedded RAM and I/O bandwidth are suited for frame buffering, image pipeline staging, and real‑time processing tasks.
• Test & Measurement Equipment Programmable logic density and configurable I/O make the device appropriate for instrument control and signal handling.

Unique Advantages

• High Logic Density: 291,200 logic elements reduce the need for multiple FPGAs or external logic, simplifying system architecture.
• Substantial On‑Chip Memory: Approximately 17.66 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Broad I/O Count: 289 I/O pins enable flexible interfacing to peripherals, memory, and parallel buses.
• Compact BGA Package: 780‑pin BGA (33×33 supplier package) allows high density routing and compact board footprints.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, aligning with standard commercial product requirements.
• Standards‑Aware Family Design: Built on the Stratix IV family with documented high‑speed transceiver features and wide protocol support for bandwidth‑intensive systems.

Why Choose EP4SGX290FH29C2XG?

The EP4SGX290FH29C2XG combines high logic element count, significant on‑chip RAM, and a large I/O complement in a single commercial‑grade BGA package—making it well suited for designers who need dense, integrated FPGA capability for high‑bandwidth, compute‑intensive, or I/O‑heavy applications. Its Stratix IV family lineage provides documented device features for high aggregate data bandwidth and transceiver capabilities that align with demanding communications and processing tasks.

This part is aimed at system designers and engineers building solutions where consolidation of logic and memory on‑die reduces board complexity and BOM while supporting high data throughput within a commercial temperature envelope.

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