EP4SGX290FF35I4G

IC FPGA 564 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,142 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290FF35I4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX290FF35I4G is an Intel FPGA from the Stratix IV family, designed for high-density programmable logic integration. It combines a large logic fabric with embedded memory and advanced I/O capability in a surface-mount FCBGA package for industrial applications.

This device targets systems that require substantial on-chip logic and memory capacity, broad I/O counts, and operation across an industrial temperature range. Key value comes from the Stratix IV architecture elements cited in the device documentation, including embedded memory, DSP blocks, PLLs, and high-speed transceiver features.

Key Features

  • Logic Capacity — 291,200 logic elements to implement large FPGA designs and complex control or data-processing functions.
  • Embedded Memory — Total on-chip RAM of 17,661,952 bits, approximately 17.66 Mbits of embedded memory for buffering, FIFOs, and local storage.
  • I/O and Connectivity — 564 user I/O pins to support wide external interfacing and parallel/serial connections.
  • Stratix IV Architecture Features — Device documentation references Stratix IV capabilities including embedded memory, DSP blocks, PLLs, high-speed transceivers, clock networks, and external memory interface support.
  • Package and Mounting — 1152-pin FCBGA / FBGA (1152-FBGA, 35×35) surface-mount package to accommodate high pin counts and dense board integration.
  • Power — Specified core voltage supply range of 870 mV to 930 mV for the device core.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, appropriate for industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • High-speed communications — Use of the Stratix IV transceiver and I/O features for protocol bridging, link aggregation, and serial data transport.
  • External memory interfaces — Implementing controllers and interfaces that require tight integration between programmable logic and external memory subsystems.
  • Signal processing and DSP acceleration — Leveraging the device’s large logic element count and documented DSP blocks for real-time data processing and filtering tasks.
  • Industrial control systems — Deploying high-density programmable logic in industrial environments where the −40 °C to 100 °C operating range and surface-mount FCBGA packaging are required.

Unique Advantages

  • High logic density: 291,200 logic elements provide capacity for complex state machines, datapaths, and integration of multiple functions on a single device.
  • Substantial on-chip RAM: Approximately 17.66 Mbits of embedded memory reduces the need for external buffering and supports intensive local data handling.
  • Extensive I/O: 564 I/O pins enable flexible system interfacing and support for multiple external peripherals or high-bandwidth parallel buses.
  • Stratix IV feature set: Architecture elements called out in the device handbook—such as DSP blocks, PLLs, clock networks, and high-speed transceivers—help implement timing-critical and high-throughput designs.
  • Industrial robustness: Specified operating range from −40 °C to 100 °C and RoHS compliance support deployment in industrial-grade applications.
  • High-pin-count packaging: 1152-pin FCBGA/FBGA (35×35) supports dense board integration and routing for complex systems.

Why Choose EP4SGX290FF35I4G?

The EP4SGX290FF35I4G positions itself as a high-capacity Stratix IV FPGA option for designers needing a large programmable fabric, significant embedded memory, and broad I/O in an industrial-temperature, surface-mount package. Its documented architecture elements (embedded memory, DSP blocks, PLLs, and high-speed transceivers) align it with applications that demand integrated signal processing and complex I/O interfacing.

This device is suited to engineers and teams building industrial and communications equipment where on-chip resources, I/O scale, and temperature resilience are key considerations. The combination of a large logic element count, multi-megabit embedded RAM, and an industrial-grade temperature specification provides a reliable platform for scalable, long-lived designs.

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