EP4SGX290FF35I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,142 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290FF35I4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX290FF35I4G is an Intel FPGA from the Stratix IV family, designed for high-density programmable logic integration. It combines a large logic fabric with embedded memory and advanced I/O capability in a surface-mount FCBGA package for industrial applications.
This device targets systems that require substantial on-chip logic and memory capacity, broad I/O counts, and operation across an industrial temperature range. Key value comes from the Stratix IV architecture elements cited in the device documentation, including embedded memory, DSP blocks, PLLs, and high-speed transceiver features.
Key Features
- Logic Capacity — 291,200 logic elements to implement large FPGA designs and complex control or data-processing functions.
- Embedded Memory — Total on-chip RAM of 17,661,952 bits, approximately 17.66 Mbits of embedded memory for buffering, FIFOs, and local storage.
- I/O and Connectivity — 564 user I/O pins to support wide external interfacing and parallel/serial connections.
- Stratix IV Architecture Features — Device documentation references Stratix IV capabilities including embedded memory, DSP blocks, PLLs, high-speed transceivers, clock networks, and external memory interface support.
- Package and Mounting — 1152-pin FCBGA / FBGA (1152-FBGA, 35×35) surface-mount package to accommodate high pin counts and dense board integration.
- Power — Specified core voltage supply range of 870 mV to 930 mV for the device core.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, appropriate for industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- High-speed communications — Use of the Stratix IV transceiver and I/O features for protocol bridging, link aggregation, and serial data transport.
- External memory interfaces — Implementing controllers and interfaces that require tight integration between programmable logic and external memory subsystems.
- Signal processing and DSP acceleration — Leveraging the device’s large logic element count and documented DSP blocks for real-time data processing and filtering tasks.
- Industrial control systems — Deploying high-density programmable logic in industrial environments where the −40 °C to 100 °C operating range and surface-mount FCBGA packaging are required.
Unique Advantages
- High logic density: 291,200 logic elements provide capacity for complex state machines, datapaths, and integration of multiple functions on a single device.
- Substantial on-chip RAM: Approximately 17.66 Mbits of embedded memory reduces the need for external buffering and supports intensive local data handling.
- Extensive I/O: 564 I/O pins enable flexible system interfacing and support for multiple external peripherals or high-bandwidth parallel buses.
- Stratix IV feature set: Architecture elements called out in the device handbook—such as DSP blocks, PLLs, clock networks, and high-speed transceivers—help implement timing-critical and high-throughput designs.
- Industrial robustness: Specified operating range from −40 °C to 100 °C and RoHS compliance support deployment in industrial-grade applications.
- High-pin-count packaging: 1152-pin FCBGA/FBGA (35×35) supports dense board integration and routing for complex systems.
Why Choose EP4SGX290FF35I4G?
The EP4SGX290FF35I4G positions itself as a high-capacity Stratix IV FPGA option for designers needing a large programmable fabric, significant embedded memory, and broad I/O in an industrial-temperature, surface-mount package. Its documented architecture elements (embedded memory, DSP blocks, PLLs, and high-speed transceivers) align it with applications that demand integrated signal processing and complex I/O interfacing.
This device is suited to engineers and teams building industrial and communications equipment where on-chip resources, I/O scale, and temperature resilience are key considerations. The combination of a large logic element count, multi-megabit embedded RAM, and an industrial-grade temperature specification provides a reliable platform for scalable, long-lived designs.
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