EP4SGX290FF35I4

The EP4SGX290FF35I4 is a Stratix® IV GX FPGA from Intel, built on the Stratix IV device family architecture. It delivers high logic density and on-chip memory combined with I/O and transceiver features targeted at high-bandwidth, protocol-diverse systems.

Designed for industrial applications, this surface-mount FCBGA device integrates 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 564 I/O pins in a 1152-BBGA package, providing a platform for compute-intensive, high-throughput designs.

Key Features

• Core Logic – 291,200 logic elements for implementing complex programmable logic and system functions.
• Embedded Memory – Approximately 17.66 Mbits of on-chip RAM to support buffering, local storage and intermediate data processing.
• I/O Capacity – 564 I/O pins to support extensive peripheral, memory and interface connectivity.
• High-Speed Transceiver & Protocol Support – Stratix IV GX device family features for high aggregate data bandwidth and a wide range of protocol support as described in the device handbook.
• Clocking and Timing – Integrated clock networks and PLL resources referenced in the device handbook to support complex timing and system synchronization.
• Power Supply Range – Core voltage supply range of 870 mV to 930 mV for defined power planning and regulator selection.
• Package & Mounting – 1152-BBGA (35×35 FCBGA) surface-mount package suitable for compact, high-density board designs.
• Operating Conditions – Industrial grade device rated for operation from −40 °C to 100 °C.

Typical Applications

• High-bandwidth Networking & Telecom – Use the device’s high aggregate data bandwidth and protocol support for packet processing, line cards and protocol bridging.
• Data Acceleration – Leverage the large logic and memory resources for on-board data processing, packet buffering and acceleration functions.
• Video & Signal Processing – Combine dense logic, embedded RAM and Stratix IV DSP-capable architecture for real-time video and signal pipeline implementations.

Unique Advantages

• High Logic Density: 291,200 logic elements enable implementation of large, complex designs on a single device, reducing system-level component count.
• Significant On-chip Memory: Approximately 17.66 Mbits of embedded RAM supports local buffering and state storage to improve throughput and reduce external memory dependence.
• Extensive I/O: 564 I/O pins provide the connectivity needed for multi-interface systems and high-pin-count peripherals.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for use in environments requiring extended operating temperature capability.
• Robust Packaging: 1152-BBGA FCBGA package supports compact PCB implementations while accommodating the device’s I/O and thermal needs.

Why Choose EP4SGX290FF35I4?

The EP4SGX290FF35I4 places a high-density Stratix IV GX FPGA into a 1152-BBGA form factor, combining 291,200 logic elements, substantial embedded memory and 564 I/O pins for demanding, bandwidth-oriented designs. Its documented Stratix IV architecture features—high-speed transceivers, clock networks, PLLs and support for a wide range of protocols—make it suitable for engineers building protocol-rich, high-throughput systems.

As an industrial-grade Intel Stratix IV device, EP4SGX290FF35I4 is positioned for applications that require sustained operation across a wide temperature range and well-defined supply requirements, offering a scalable platform for complex embedded and communications designs.

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