EP4SGX290FH29C2X

IC FPGA 289 I/O 780HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 17661952 291200 780-BBGA, FCBGA

Quantity 1,624 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O289Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290FH29C2X – Stratix® IV GX Field Programmable Gate Array (FPGA), 291,200 logic elements

The EP4SGX290FH29C2X is a Stratix® IV GX field programmable gate array (FPGA) in a 780‑ball BGA (FCBGA) package. It provides a high logic density fabric with significant on‑chip memory and a large number of I/O pins for complex, programmable digital systems.

Engineered for commercial temperature operation, this device targets applications that require substantial logic resources, extensive embedded RAM, and broad I/O count while operating from a core supply in the 0.87 V to 0.93 V range.

Key Features

  • Logic Capacity — Contains 291,200 logic elements, enabling implementation of large-scale digital designs and complex logic functions within a single device.
  • Embedded Memory — Approximately 17.66 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑centric logic without external memory dependence.
  • I/O Density — 289 user I/O pins to accommodate high‑pin‑count interfaces and extensive peripheral connectivity.
  • Package and Mounting — 780‑ball BGA package (FCBGA) with supplier device package noted as 780‑HBGA (33×33); surface mount for PCB integration.
  • Power — Operates from a specified supply range of 0.87 V to 0.93 V, allowing precise power budgeting for core domains.
  • Operating Range — Commercial grade device rated for 0 °C to 85 °C ambient operation.
  • Standards and Compliance — RoHS compliant to support environmentally regulated designs.
  • Series Documentation — Device belongs to the Stratix IV family with available device handbook content covering DC/switching characteristics, I/O standards, transceiver and DSP block specifications, PLLs, and configuration details.

Typical Applications

  • High‑density digital systems — Leverage the large logic element count and embedded RAM for complex state machines, protocol stacks, and glue logic consolidation.
  • Data buffering and memory‑centric designs — Use the substantial on‑chip RAM for packet buffering, FIFOs, and intermediate storage to reduce external memory requirements.
  • High‑I/O interface hubs — Take advantage of 289 I/O pins for multi‑port connectivity, parallel interfaces, and integration with numerous peripherals.

Unique Advantages

  • High logic density: 291,200 logic elements enable consolidation of complex functions into a single FPGA, reducing board count and BOM complexity.
  • Significant embedded memory: Approximately 17.66 Mbits of on‑chip RAM provides on‑device storage for buffering and data processing without immediate reliance on external memories.
  • Extensive I/O capability: 289 I/O pins allow flexible interfacing across numerous digital channels and peripheral devices.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial product requirements.
  • Clear power envelope: Defined supply range of 0.87 V to 0.93 V enables predictable power domain design and supply sequencing.
  • Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and regulatory requirements.

Why Choose EP4SGX290FH29C2X?

The EP4SGX290FH29C2X positions itself as a high‑capacity Stratix IV GX FPGA option for designs demanding large programmable logic resources, substantial embedded RAM, and broad I/O. Its commercial temperature rating and defined supply range make it suitable for mainstream industrial and commercial electronics where a balance of density and predictable operating characteristics is required.

This device is well suited to engineering teams building complex digital systems that benefit from on‑chip memory, high I/O counts, and the detailed device guidance available in the Stratix IV device handbook. The combination of logic resources, memory, and package density supports scalable designs and longer product lifecycles within the Stratix IV family documentation framework.

Request a quote or submit an inquiry to receive current pricing and availability for EP4SGX290FH29C2X and to discuss how it can fit into your next FPGA design.

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