EP4SGX290FF35I3N

The EP4SGX290FF35I3N is an Intel Stratix IV GX field programmable gate array (FPGA) in a 1152-FBGA (35×35) package. It delivers high logic density and on-chip memory for complex, programmable system designs.

Key device characteristics include 291,200 logic elements, approximately 17.66 Mbits of embedded memory, 564 I/O pins, a low-voltage core supply range (870 mV to 930 mV), and an industrial operating temperature range of −40 °C to 100 °C. The device datasheet and Stratix IV device handbook provide detailed electrical, switching, transceiver, DSP, PLL and configuration specifications for system integration and validation.

Key Features

• Core Density  291,200 logic elements for implementing large-scale programmable logic and complex state machines.
• Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O and Peripherals  564 I/O pins to support wide parallel interfaces and high-pin-count system connectivity.
• Low-Voltage Core  Core voltage supply range of 870 mV to 930 mV to match low-voltage system power rails and allow efficient power distribution.
• Package & Mounting  1152-FBGA (35×35) surface-mount package optimized for compact, high-density PCBs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environment deployments.
• Comprehensive Documentation  Datasheet and device handbook coverage includes DC and switching characteristics, transceiver and DSP block specifications, clocking/PLL details, and configuration/JTAG information for robust design validation.

Typical Applications

• High-speed communications  Use the Stratix IV GX device where transceiver performance and large I/O counts are required for network interfaces and protocol bridging.
• Digital signal processing  Leverage the device’s large logic capacity and on-chip RAM for DSP algorithms, filtering, and real-time data processing.
• High-density system integration  Implement complex system controllers and glue logic that demand many I/Os and significant programmable resources.
• Industrial control  Industrial-temperature rating and robust packaging suit control systems, automation, and instrumentation requiring reliable operation across wide temperatures.

Unique Advantages

• High logic capacity: 291,200 logic elements enable implementation of feature-rich, multi-function designs without partitioning across multiple devices.
• Significant embedded memory: Approximately 17.66 Mbits of on-chip RAM reduces external memory dependency and simplifies board-level BOM.
• Extensive I/O: 564 I/Os provide flexibility for parallel buses, multiple interfaces, and high-pin-count connectivity.
• Industrial thermal range: Rated from −40 °C to 100 °C for deployments in demanding environmental conditions.
• Compact surface-mount package: 1152-FBGA (35×35) offers a space-efficient footprint for dense PCB layouts.
• Detailed technical documentation: Device handbook and datasheet sections covering electrical characteristics, transceivers, DSP blocks, PLLs, and configuration help accelerate design and validation.

Why Choose EP4SGX290FF35I3N?

The EP4SGX290FF35I3N combines high logic density, substantial embedded memory, and a large I/O complement in a compact 1152-FBGA package, making it well suited to complex, industrial-grade FPGA designs. Its low-voltage core and comprehensive datasheet support enable system designers to integrate advanced processing, high-speed interfaces, and robust control functions while maintaining predictable power and thermal characteristics.

This device is appropriate for engineering teams building sophisticated communications, signal processing, and industrial control systems that require programmable flexibility, scalable resources, and clear technical documentation for validation and production deployment.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP4SGX290FF35I3N. Our team can provide the technical and procurement details you need to move your design forward.