EP4SGX290FF35C4N

The EP4SGX290FF35C4N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, built for applications that require high logic density and extensive I/O integration. It delivers a large fabric with 291,200 logic elements and on-chip embedded memory to support complex digital designs.

Designed as a commercial-grade, surface-mount device in a 1152-BBGA/FCBGA package (1152-FBGA, 35×35), this device is targeted at systems that need abundant I/O, significant embedded RAM capacity, and documented Stratix IV family features such as high-speed transceiver and DSP support as described in the device handbook.

Key Features

• Core Logic  291,200 logic elements provide substantial programmable fabric for implementing complex state machines, datapaths, and custom logic.
• Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffering, FIFOs, and firm-state data storage within the FPGA fabric.
• I/O Density  564 user I/Os enable broad connectivity for multi-channel interfaces, parallel buses, and peripheral aggregation.
• Package & Mounting  Commercial-grade 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35) for surface-mount PCB assembly and compact system integration.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match target power domains and regulator designs.
• Operating Range  Commercial operating temperature range 0 °C to 85 °C for standard temperature environments.
• Compliance  RoHS compliant for conformity with common environmental requirements.
• Stratix IV Family Documentation  Device is part of the Stratix IV GX family; detailed architecture, transceiver, DSP block, PLL, and I/O feature descriptions are available in the Stratix IV Device Handbook.

Typical Applications

• Network & Communications Equipment  Use the device’s large logic capacity and extensive I/O to implement packet processing, protocol bridging, and interface aggregation.
• Digital Signal Processing  On-chip memory combined with the Stratix IV family’s DSP-focused architecture supports high-density signal processing tasks and algorithm acceleration.
• System Integration & Prototyping  High logic element count and abundant I/O make the FPGA suitable for integrating multiple subsystems, validating hardware/software co-designs, and prototyping complex SoC functions.
• Memory Interface Controllers  Use the device’s resources to implement external memory interfaces and controller logic with embedded RAM for buffering and command staging.

Unique Advantages

• High logic density: 291,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 17.66 Mbits of embedded memory lowers external memory dependence for buffering and intermediate storage.
• Extensive I/O count: 564 I/Os provide flexible connectivity for multi-lane interfaces and mixed-signal peripheral integration.
• Documented Stratix IV feature set: Inclusion in the Stratix IV GX family means documented architecture sections (transceivers, DSP blocks, PLLs, I/O) to support design planning and integration.
• Commercial package and RoHS compliant: Surface-mount 1152-BBGA package and RoHS compliance facilitate assembly and regulatory alignment for commercial products.
• Defined supply and thermal envelope: Core voltage range (870 mV–930 mV) and operating temperature (0 °C–85 °C) allow precise power and thermal system design.

Why Choose EP4SGX290FF35C4N?

The EP4SGX290FF35C4N positions itself as a high-capacity FPGA choice within the Stratix IV GX family, combining a large programmable fabric, significant embedded RAM, and a high I/O count in a compact 1152-BBGA package. Its documented family features—including transceiver, DSP, and I/O capabilities described in the Stratix IV Device Handbook—help engineers map system requirements to available on-chip resources.

This part is well suited for designers who need to integrate multiple high-density functions on a single FPGA, reduce external component count, and rely on detailed device documentation for system-level planning. Its commercial-grade rating, RoHS compliance, and defined electrical and thermal ranges support reliable deployment in standard commercial environments.

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