EP4SGX290FF35C3N

The EP4SGX290FF35C3N is a Stratix IV GX field programmable gate array (FPGA) IC from Intel, provided in a 1152‑BBGA (35×35) FCBGA package with surface‑mount mounting. It delivers high logic capacity and on‑chip memory in a commercial‑grade device suitable for complex, board‑level programmable logic implementations.

With 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 564 I/O pins, this device targets applications that require dense logic, abundant I/O connectivity, and flexible on‑chip resources while operating within a commercial temperature range.

Key Features

• High Logic Capacity — 291,200 logic elements to implement large, custom digital designs and complex control or processing functions.
• Embedded Memory — Approximately 17.66 Mbits of on‑chip RAM for data buffering, lookup tables, and state storage.
• I/O Density — 564 user I/O pins for extensive external interfacing and parallel connectivity options.
• Core Voltage — Operates with a core supply range of 870 mV to 930 mV, enabling precise power provisioning at the device core.
• Package and Mounting — 1152‑BBGA (35×35) FCBGA surface‑mount package suitable for compact board designs requiring high pin count.
• Commercial‑Grade Temperature — Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• Series‑Level Capabilities (Stratix IV) — Device family documentation indicates integrated features such as PLLs, transceivers, DSP block specifications, and TriMatrix memory block architecture for advanced system design (refer to the Stratix IV device handbook for series‑level details).
• Standards Compliance — RoHS compliant.

Typical Applications

• Custom Digital Logic — Implement large, application‑specific logic functions using the device’s 291,200 logic elements and abundant I/O resources.
• Data Buffering and Memory‑Intensive Functions — Leverage approximately 17.66 Mbits of embedded RAM for buffering, packet queues, or on‑chip data storage.
• High‑I/O System Integration — Use 564 I/O pins to interface with multiple peripherals, sensors, or parallel buses on complex boards.

Unique Advantages

• Large On‑Chip Resource Pool: High logic element count and substantial embedded memory support densely integrated designs without immediate reliance on external memory.
• Extensive Connectivity: 564 I/O pins enable broad peripheral and subsystem integration, reducing the need for external I/O expanders.
• Compact High‑Pin Package: 1152‑BBGA FCBGA package delivers high pin count in a compact footprint suitable for space‑constrained PCBs.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for standard commercial deployments where that range is required.
• RoHS Compliance: Environmentally compliant for regions and products requiring RoHS‑compatible components.
• Series‑Level System Features: Stratix IV family documentation indicates integrated system features (PLLs, transceivers, DSP and memory block architectures) to support advanced design requirements.

Why Choose EP4SGX290FF35C3N?

The EP4SGX290FF35C3N positions itself as a high‑capacity, commercial‑grade Stratix IV GX FPGA that combines large programmable logic resources, substantial embedded memory, and a high I/O count in a compact 1152‑BBGA FCBGA package. Its electrical and series‑level capabilities make it appropriate for designers who need significant on‑chip resources and flexible connectivity on board‑level systems.

This device is suitable for customers developing complex digital systems that require scalability of logic and memory resources, predictable commercial temperature operation, and RoHS compliance. The combination of device resources and package density supports long‑lifecycle, scalable designs where a high level of integration is required.

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