EP4SGX290FF35C2X

The EP4SGX290FF35C2X from Intel is a high-density Stratix® IV GX field programmable gate array (FPGA) supplied in a 1152-BBGA (35×35) FCBGA package. It provides substantial on-chip resources including 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 564 user I/Os for complex digital designs.

This commercial-grade, surface-mount FPGA operates over a core supply range of 870 mV to 930 mV and is specified for an ambient operating temperature range of 0 °C to 85 °C. The device is RoHS-compliant.

Key Features

• Core Logic  291,200 logic elements provide the routing and combinational/sequential resources needed for large-scale custom logic implementations.
• Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Capacity  564 user I/Os enable broad external interfacing and high pin-count connectivity in a single device.
• Package and Mounting  1152-BBGA, FCBGA (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for dense board-level integration.
• Power  Operates from a nominal core supply range of 870 mV to 930 mV to match system power architectures requiring low-voltage FPGA cores.
• Temperature and Grade  Commercial-grade device specified for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

• Custom digital logic and prototyping  Use the device's 291,200 logic elements and embedded memory to implement and iterate complex digital designs on a single FPGA.
• High-density I/O aggregation  The 564 I/Os support designs that require extensive peripheral and bus connectivity at the device boundary.
• On-chip data buffering  Approximately 17.66 Mbits of embedded RAM provide local storage for buffering, queuing, and temporary data handling without immediate dependence on external memory.

Unique Advantages

• High logic capacity: 291,200 logic elements enable large, integration-rich designs that consolidate multiple functions into one FPGA.
• Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
• Extensive I/O count: 564 user I/Os simplify board-level routing by providing ample signals for interfaces, sensors, and peripherals.
• Compact, manufacturable package: 1152-BBGA (35×35) FCBGA surface-mount package supports dense system integration and automated assembly.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to match a wide range of standard electronic applications.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4SGX290FF35C2X?

The EP4SGX290FF35C2X positions itself as a high-capacity, commercially graded Stratix® IV GX FPGA suited to designs that require large logic density, significant embedded memory, and a high number of I/Os within a single, surface-mount package. Its specification for low-voltage core operation and RoHS compliance align it with contemporary system power and manufacturing requirements.

This device is ideal for engineering teams and procurement organizations seeking a scalable FPGA platform that consolidates multiple functions, reduces board-level complexity, and supports dense integration. The combination of logic elements, on-chip RAM, and I/O count provides long-term flexibility for evolving digital designs.

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