EP4SGX230KF40I3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17544192 228000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 290 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230KF40I3N – Stratix IV GX FPGA, 228,000 logic elements, 1517-FBGA
The EP4SGX230KF40I3N is a Stratix® IV GX field-programmable gate array (FPGA) offering a high-density fabric with 228,000 logic elements and features targeted at high‑bandwidth system designs. The device family architecture includes dedicated resources for high-speed transceivers, DSP functions, clock networks and external memory interfaces.
With approximately 17.5 Mbits of embedded memory, 744 user I/Os and an industrial operating range, this FPGA addresses applications that require large logic capacity, substantial on-chip RAM and broad I/O connectivity while operating at a low core supply range (870 mV to 930 mV).
Key Features
- Core Capacity — 228,000 logic elements provide significant programmable fabric for complex digital designs and system integration.
- Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM to support large buffering, frame storage and local data processing.
- I/O Density — 744 user I/Os suitable for wide parallel interfaces, external memory buses and multiple peripheral connections.
- High‑Speed Transceiver & Bandwidth Features — Device family documentation highlights high‑speed transceiver features and architecture optimized for high aggregate data bandwidth and a wide range of protocol support.
- DSP and Clocking Resources — Architecture-level support for digital signal processing blocks, PLLs and flexible clock networks for timing-critical applications.
- Power and Voltage — Core supply specified from 870 mV to 930 mV to match platform power architectures.
- Packaging & Mounting — 1517-BBGA, FCBGA (supplier device package: 1517-FBGA 40×40) in a surface-mount form factor for compact, high-density board designs.
- Temperature & Grade — Industrial operating temperature range from −40°C to 100°C for deployment in demanding environments.
- Regulatory — RoHS compliant.
Typical Applications
- High‑speed Communications — Leverage the Stratix IV GX transceiver and high aggregate bandwidth features for protocol bridging, aggregation and backplane interfaces.
- Digital Signal Processing — Use the device's large logic fabric and embedded memory for filtering, modulation/demodulation and real‑time signal processing pipelines.
- External Memory Interfaces — Implement high-performance memory controllers and wide data buses using the device's I/O and dedicated interface features.
- High‑density Embedded Systems — Integrate multiple functions on a single FPGA to reduce BOM and simplify system architectures for industrial applications.
Unique Advantages
- Highly integrated solution: 228,000 logic elements and abundant embedded memory minimize the need for external glue logic and off‑chip RAM for many designs.
- Extensive I/O and interface capability: 744 user I/Os provide the flexibility to connect to multiple peripherals, memory devices and high‑speed links without external multiplexers.
- Architected for bandwidth: Family-level transceiver and bandwidth features enable implementation of high‑throughput protocols and aggregation functions.
- Industrial robustness: Rated for −40°C to 100°C operation and supplied in a rugged FCBGA package for long-term deployed systems.
- Regulatory compliance: RoHS status ensures the device meets common environmental requirements for commercial and industrial products.
Why Choose EP4SGX230KF40I3N?
EP4SGX230KF40I3N positions itself as a high-capacity Stratix IV GX FPGA for designs that demand large logic resources, substantial on‑chip RAM and expansive I/O connectivity. Its architecture includes features described in the Stratix IV device handbook—such as high‑speed transceivers, DSP blocks and flexible clocking—that support complex, bandwidth‑oriented system designs.
This device is well suited to engineering teams building industrial and high‑performance embedded systems where integration density, thermal range and adherence to RoHS are required. Comprehensive device documentation is available to guide implementation and system integration choices.
Request a quote or submit an inquiry to evaluate EP4SGX230KF40I3N for your next high‑density FPGA project.

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