EP4SGX230KF40I3G

The EP4SGX230KF40I3G is an Intel Stratix IV family FPGA designed for high-density, industrial-grade programmable logic applications. It combines a large logic fabric with substantial on‑chip memory and a broad I/O count to support compute- and I/O-intensive designs.

This device is suited for systems requiring extensive logic resources, significant embedded memory, and robust operating range, offering a platform for custom digital signal processing, protocol implementation, and system integration tasks.

Key Features

• Core Logic  Approximately 228,000 logic elements provide extensive programmable resources for complex combinational and sequential designs.
• Embedded Memory  Approximately 17.5 Mbits of on‑chip RAM (17,544,192 bits) to support buffers, FIFOs, and local storage.
• I/O Density  744 user I/O pins to interface with a wide range of peripherals, memory devices, and external subsystems.
• Device Family Features  As part of the Stratix IV device family, the device is associated with high-speed transceiver features, DSP blocks, PLLs, and comprehensive clock networks as described in the Stratix IV device handbook.
• Power  Core voltage supply range specified at 870 mV to 930 mV to match target power domains and system requirements.
• Thermal and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Package & Mounting  1517‑BBGA (FCBGA) supplier package, 1517‑FBGA (40×40), designed for surface-mount PCB assemblies.
• Environmental Compliance  RoHS compliant for materials and manufacturing processes.

Typical Applications

• High‑Performance Signal Processing  Leverage approximately 228,000 logic elements and embedded memory to implement custom DSP pipelines and filtering algorithms.
• Protocol and Interface Bridging  Use the device’s large I/O count (744 pins) and Stratix IV family I/O features to implement complex protocol converters and multi‑channel interfaces.
• Embedded System Integration  Integrate control logic, local memory buffers (≈17.5 Mbits), and timing resources for compact system designs in industrial equipment.
• High‑Throughput Data Handling  Deploy the on‑chip memory and logic resources to manage data buffering, aggregation, and preprocessing before external memory or host transfer.

Unique Advantages

• Large Logic Capacity: Approximately 228,000 logic elements enable dense implementations and complex state machines without immediate need for external logic.
• Substantial On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM reduce dependence on external memory for intermediate storage, lowering board-level complexity.
• High I/O Count: 744 I/O pins support multi‑lane interfaces, parallel buses, and numerous peripheral connections for system-level flexibility.
• Industrial Temperature Range: Rated for −40 °C to 100 °C, suitable for installations requiring extended operating conditions.
• Industry Compliance: RoHS‑compliant construction supports regulatory and environmental requirements.
• Compact Surface‑Mount Package: 1517‑FBGA (40×40) package enables high‑density PCB layout and reliable surface-mount assembly.

Why Choose EP4SGX230KF40I3G?

The EP4SGX230KF40I3G positions itself as a high‑capacity, industrial‑grade Stratix IV FPGA option for designers needing extensive logic, significant embedded memory, and large I/O resources in a single surface‑mount package. Its specified core voltage range and broad operating temperature make it appropriate for robust system implementations.

This device is ideal for teams implementing complex digital processing, multi‑interface bridging, or data‑intensive tasks that benefit from on‑chip memory and a large logic fabric. Backed by the Stratix IV device family handbook, it provides architectural features such as DSP blocks, PLLs, and clock networks that support scalable, high‑performance FPGA designs.

Request a quote or submit an inquiry to receive pricing, lead‑time, and availability information for EP4SGX230KF40I3G and to discuss how it can be integrated into your next design.