EP4SGX230KF40C4G

The EP4SGX230KF40C4G is a commercial-grade FPGA from Intel, documented in the Stratix IV Device Handbook. It provides a high-capacity programmable fabric with 228,000 logic elements and approximately 17.5 Mbits of embedded memory, targeting designs that require large-scale logic integration and substantial on-chip RAM.

With 744 I/O pins, Stratix IV–series architectural features (including high-speed transceiver and DSP-related capabilities described in the device handbook), and an FCBGA 1517-BBGA package, this device is aimed at applications needing dense logic, extensive I/O connectivity, and scalable system integration while operating at standard commercial conditions.

Key Features

• Logic Capacity — 228,000 logic elements (cells) to implement complex digital logic and large-scale programmable designs.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM for buffering, tables, and scratchpad storage within the FPGA fabric.
• I/O Density — 744 I/O pins provide broad external connectivity for parallel buses, memory interfaces, and peripherals.
• Stratix IV Series Architecture — Device documentation is provided in the Stratix IV Device Handbook, which details fabric, clocking, PLLs, DSP blocks, and high-speed transceiver features applicable to this series.
• Package and Mounting — Supplied in a 1517-BBGA FCBGA (1517-FBGA, 40×40) package for surface-mount PCB assembly.
• Power Supply — Core voltage supply range: 870 mV to 930 mV.
• Operating Temperature — Commercial-grade operating range from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-speed communications — Leverage the Stratix IV–series transceiver and abundant I/O to implement protocol interfaces and high-throughput link aggregation.
• Signal processing and DSP — Large logic capacity and the series’ DSP-related architecture enable implementation of complex signal-processing chains and algorithm acceleration.
• Memory interface and buffering — Approximately 17.5 Mbits of embedded RAM combined with 744 I/O pins supports external memory bridging, packet buffering, and data alignment tasks.
• System integration and prototyping — High logic density and extensive I/O make the device suitable for integrating multiple subsystems and validating complex digital designs on a single chip.

Unique Advantages

• Large programmable fabric: 228,000 logic elements allow implementation of sizeable digital systems without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O connectivity: 744 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and wide external bus implementations.
• Documented series-level features: The Stratix IV Device Handbook documents architecture elements such as PLLs, clock networks, and high-speed transceivers that inform system-level design and integration.
• Commercial-grade operating range: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronic products.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose EP4SGX230KF40C4G?

The EP4SGX230KF40C4G combines high logic density, significant embedded memory, and a large complement of I/O in a surface-mount 1517-FBGA package, making it suitable for complex digital systems that require integration of many functions on a single FPGA. Documentation in the Stratix IV Device Handbook provides design guidance on the family’s architectural elements—useful when planning clocking, transceiver, and DSP subsystems.

This device is positioned for engineers and teams building high-capacity commercial applications where abundant logic elements, on-chip RAM, and extensive I/O enable consolidation of functionality, streamlined board-level design, and predictable operating conditions.

Request a quote or submit an inquiry to our sales team to evaluate EP4SGX230KF40C4G for your next high-capacity FPGA design.