EP4SGX230KF40C3G

The EP4SGX230KF40C3G is a Stratix IV–family Field Programmable Gate Array (FPGA) from Intel, built for applications that require substantial on-chip logic, memory and I/O resources. It combines a large fabric of programmable logic with abundant embedded memory and high I/O density to support high-bandwidth protocol, transceiver and system-integration use cases.

Key hardware characteristics include approximately 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 744 I/O pins, making the device suitable for communications, data-path processing, and other compute- and I/O-intensive commercial designs.

Key Features

• Core Logic  Approximately 228,000 logic elements to implement complex digital functions and custom architectures.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density  744 I/O pins provide flexible interfacing to external devices and parallel interfaces.
• Package & Mounting  1517-FBGA (40×40) supplier device package; FCBGA / 1517-BBGA package case; surface-mount device optimized for board-level assembly.
• Power  Core supply voltage range specified at 870 mV to 930 mV for the device core domain.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• On-chip Resources  Device handbook references for the Stratix IV family list rich architecture features such as DSP blocks, clock networks and PLLs to support timing and signal-processing functions.
• Compliance  RoHS compliant for environmental regulation adherence.

Typical Applications

• High-speed Networking & Telecom  Leverage the device’s large logic fabric, abundant I/O and Stratix IV transceiver-oriented architecture to implement protocol engines, packet processing and interface bridging.
• Data-path Acceleration  On-chip memory and DSP-supporting architecture enable buffering, packet/frame processing and algorithm acceleration in commercial compute systems.
• External Memory Interfaces  Use the device’s I/O density and device-family memory-interface features to connect to external DRAM and high-bandwidth peripherals.
• High-bandwidth Video & Signal Processing  Combine the embedded RAM and DSP-style resources to implement multi-channel video pipelines, real-time filtering and format conversion.

Unique Advantages

• Large Logic Capacity:  Approximately 228,000 logic elements enable implementation of complex, multi-function designs on a single device, reducing system-level component count.
• Substantial Embedded Memory:  Approximately 17.5 Mbits of on-chip RAM support local buffering and low-latency data paths without immediate dependence on external memory.
• High I/O Count:  744 I/O pins provide the connectivity needed for wide parallel buses, multiple interfaces and dense system integration.
• Commercial Temperature Grade:  Rated for 0 °C to 85 °C to match commercial deployments and typical indoor equipment operating environments.
• Standard Surface-Mount Package:  1517-FBGA (40×40) FCBGA packaging supports modern PCB assembly processes and high-density layouts.
• Regulatory Compliance:  RoHS-compliant component to support environmentally regulated product builds.

Why Choose EP4SGX230KF40C3G?

The EP4SGX230KF40C3G positions itself as a high-capacity, commercially graded Stratix IV FPGA option for designs that require significant on-chip logic, memory and I/O resources. Its combination of approximately 228,000 logic elements, roughly 17.5 Mbits of embedded RAM and 744 I/O pins provides the building blocks for protocol-heavy, high-throughput and data-path-centric applications.

Design teams targeting communications equipment, data-path accelerators, video processing or complex system integration will find a scalable hardware platform in this device, backed by Stratix IV family architecture resources such as DSP blocks, clock networks and PLLs as documented in the device handbook.

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